DDPAK based SMD solutions allow to reach up to 20 percent higher output power on the board temperature level of a standard cooling concept enabling higher power density at a given form …

TO-252, also known as DPAK [1] or Decawatt Package, is a semiconductor package developed by Motorola [2] for surface mounting on circuit boards. [3] It represents a surface-mount [4] …

With the D-DPAK package, Infineon Technologies introduced the first top-side cooled surface mount device (SMD) package addressing high power SMPS applications such as PC power, …

Influences of stray inductances of package leads (significant for high switching frequencies) and package resistances have been neglected. The comparison will be done by a SO-8 package …

The power dissipation for a SMD device is a function of the drain pad size, which can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. The …

2021年6月18日 · QDPAK是一种紧凑型的SMD，能够处理大电流并达到与TO-247相媲美的热性能。 QDPAK具有SMD的全部优点，限制了诸如热量通过PCB散发的缺点，并使PCB设计具有高 …

2018年6月5日 · Infineon Technologies AG offers Double DPAK (DDPAK), the first top-side cooled SMD package, addressing high power applications such as server, telecom, solar and high …

Turn to Ohmite for your DPAK and D2PAK solutions. Ohmite surface mount heatsinks are extruded, not stamped, to provide the thermal advantage required in today’s high power …

DPAK (TO-252) package, MOSFETs manufactured by Vishay, a global leader for semiconductors and passive electronic components.

CoolSiC™ MOSFET discrete 1200 V, 26 mΩ G2 in a top-side cooled Q-DPAK dual half-bridge package specifically designed for wide use in industrial application, including, industrial drives, …