However, 0.18mm - 20% is 0.144mm, which would mean a pad width that is narrower than the component pin. I am looking for an IPC specification mentioning the minimum pad width vs. component pin width, to determine whether or not it is permissible to have a pad that is slightly narrower than the pin that will be soldered to it.

2016年9月19日 · SMD is a form factor for a component (as opposed to thru-hole). A pad is what the pins of an SMD component rest on to be soldered. Presumably (I haven't used eagle pcb specifically), SMD is used to add an entire component to the layout, while pad is used for extraneous things, such as heatsinking .

2014年8月27日 · Pad adhesion to the backing material doesn't seem quite as important as preventing solder ball cracks. There are cases for SMD (some power products for thermal performance), but generally it sure looks like the current wisdom is to just go NSMD.

2012年9月2日 · Placing vias over SMD pads is pretty common and an acceptable practice provided you take good care while designing. Here are some practices I follow when I use Via in Pad: I don't tend to use through hole via in pad for 0201 passives. The pads for an 0201 are pretty small for a through hole mechanical drill and may damage the pad in the process.

2021年6月9日 · I'm currently designing a board and one of the SMD components has a particularly small package of 1.5x2.5 mm (CYSJ106C datasheet). It doesn't have a recommended landing pad in the datasheet and these general solder pad recommendations from TI seem very large compared to the pins. For example, the pins have a length of 0.5 mm and from the ...

2022年1月27日 · Sometimes the shape of the pad is used to identify Pin 1. Square pad for pin 1, rounded pad for the other pins. One might argue that pads with rounded corners are less likely to de-laminate. I have no idea if this is true or not. But if it is true, it can only make a difference if there is a lot of rework being done on the PCB.

2022年1月26日 · What size should the top pin's pad be? The dimensions for this pin are given as 3.00 x 1.75 mm. About what size should the associated soldering pad be and what (if any) is the general rule?

So after you place the SMD footprint on the top layer, both "pads" are already on the top metal layer, just as they should be. "For doing that, I need to place one of the pads of the SMD component in the B.Cu layer (the "ground pad") and the other pad must be placed in the F.Cu layer (the "VCC pad").

2020年2月13日 · Eagle make copper pour connect to entire smd pad. Removing pad to polygon space in eagle. the pad in question is only there to adhere the part to the board, it serves no other purpose. I double checked that I was not using thermals when creating the polygon, then modified the footprint and removed thermals from the pad in question as well.

It doesn't make a lot of sense to me to have a heat sync connected to positive voltage. So I am wondering if I just purchased a bad batch of LEDs or if I just need to search harder for 7030 LEDs with a datasheet and cathode on the middle pad. Most similar SMD LEDs datasheets I've seen seem to only have that bottom center pad as the cathode.