2021年4月15日 · Sn–Ni alloy powders with various compositions are prepared by electrodeposition. Three current modes, including pulse potential mode, are applied and …

2023年5月2日 · As a proof of concept, we developed new high-energy Sn-based ABs, including 1.45 V Sn–Ni with 314 W h kg –1 (58 kW kg –1 and over 15,000 cycles) and 1.0 V Sn–air with …

2009年5月27日 · Electroless plating technique was used to coat Sn–Ni alloy on copper substrate with high Sn content by adding the amounts of thiourea as special complexing agent and …

Due to its low cost, the Cu/Sn/Ni microbump is the most widely used structure in electronic packaging. Recent studies have characterized the evolution of the microstructure and phase …

本文报道了一种低成本、简单高效的溶液沉积制备双金属 (Sn/Ni)掺杂多孔硅微球 (pSi@SnNi)的方法。 SnO 32- /Ni 2+ 离子通过Si溶解产生的电子被还原为Sn/Ni，通过将Sn/Ni沉积、掺杂 …

2018年10月29日 · Investigations have expanded from pure Sn to Sn-M intermetallic compound such as Cu-Sn, Co-Sn, Ni-Sn, and Fe-Sn. These Sn-M intermetallic compounds have become …

2008年4月29日 · Partial Ni-Sn phase diagram showing details of three low-temperature modifications of Ni 3 Sn 2

6 天之前 · The Ni–P layer evolution is divided into two stages: Ni–P → Ni 3 P + Ni and Ni 3 P + Sn → Ni–Sn–P, and the cold end structure evolves faster than the hot end. After 60 h under the ...

2018年10月31日 · The improved activity of Sn–Ni 3 S 2 /NF activity for water-splitting is attributed to the doping of Sn, which enhanced the intrinsic activity of Sn–Ni 3 S 2 /NF for OWS. This …

2020年2月1日 · 最后，本文研究了Sn-Ni/氟化石墨烯复合镀层的耐腐蚀性，主要讨论了氟化 石墨烯浓度的改变对复合镀层性能的影响。 实验结果表明：当氟化石墨烯的浓度