SABRE 3D Product Family - Lam Research
The SABRE ® 3D family combines Lam’s proven SABRE Electrofill ® technology with additional innovation to deliver the high-quality films needed for WLP and TSV applications at high productivity.
SABRE 3D产品系列 - Lam Research
SABRE 3D产品系列 - Lam Research. 跳到内容 . 公司概览 > 使命、指导准则和核心价值观. 领导团队. 道德与合规. 公司历史. 泛林资本（Lam Capital） 环境、社会和公司治理 > ESG 战略. 环 …
SABRE Product Family - Lam Research
Lam’s SABRE ® ECD product family, which helped pioneer the copper interconnect transition, offers the precision needed for copper damascene manufacturing on the industry’s productivity-leading platform.
Lam Research: SABRE 3D - 3D InCites
2015年7月2日 · SABRE® 3D is a next-generation electroplating product designed to meet leading-edge production requirements for advanced packaging applications. This product leverages proprietary front-end manufacturing technology and offers market-specific solutions for copper pillar and through-silicon via (TSV) fabrication.
Novellus Introduces SABRE(R) 3D Electroplating System for the Advanced ...
2010年7月12日 · Utilizing technology from Novellus' industry-leading SABRE Electrofill® copper damascene interconnect system, SABRE 3D's flexible and modular architecture delivers a range of high-productivity...
SABRE~ 3D：技术和生产力领先者：WLP Electrodeposition
2017年2月17日 · SABRE 3D设备可以扩展到多达 24 个湿式处理腔室，包括16 个电镀反应腔室以及多达 6 种不同的金属镀层。 采用低成本耗材和耐用的品质设计的部分消除了频繁的维修并且转化为低 使 用 成 本 ，使SABRE 产品系列成为业界最高的系统正常运行时间同时带来更高的产出。 更重要的是，SABRE 3D 拥有创新的电镀室设计（TurboCell TM ），通过增强 Turbo 流动的方式，提供快且均匀的电镀液传输，从而获得更快的沉积速率以及优良的晶圆均匀性。 除此之 …
Novellus Introduces SABRE® 3D Electroplating System for the …
2010年7月12日 · Utilizing technology from Novellus' industry-leading SABRE Electrofill® copper damascene interconnect system, SABRE 3D's flexible and modular architecture delivers a range of high-productivity WLP processes, including copper through-silicon vias (TSV), copper redistribution layers (RDL), pillars, under-bump metallization, and lead-free micro-bum...
Sabre Advanced 3D Systems
SABRE ADVANCED 3D, design, develop and manufacture standalone and fully integrated mobile 3D Geospatial data acquisition product solutions using LiDAR (Light Detection And Ranging) and camera solutions for mobile mapping.
Deposition - Lam Research
SABRE 3D Product Family Electrochemical Deposition (ECD) Using our proven Electrofill technology, these high-productivity systems deliver quality metal films for advanced packaging applications.
3D Electroplating System simplifies wafer level packaging.
2010年7月21日 · Utilizing technology from Novellus' industry-leading SABRE Electrofill® copper damascene interconnect system, SABRE 3D's flexible and modular architecture delivers a range of high-productivity WLP processes, including copper through-silicon vias (TSV), copper redistribution layers (RDL), pillars, under-bump metallization, and lead-free micro ...