ixys表面贴装功率器件 (smpd) 提供创新解决方案，可为众多功率电子应用提供多种设计优化机会。smpd封装的重量仅为8g，通常比同类传统功率模块轻50%，从而实现更轻巧的功率系统。由于采用dcb内部绝缘，因而多个器件可以使用同一散热器，从而减少热管理工作量。

2021年6月11日 · IXYS Surface Mount Power Devices (SMPD) provide an innovative solution that allows for many design optimization opportunities across a large number of power electronics applications. Weighing only 8g, the SMPD Package is typically lighter by 50% than comparable conventional power modules, thereby enabling lower weight power systems.

2019年1月2日 · IXYS, a Littelfuse technology's surface mount power device (SMPD) series provides a MOSFET power device with all the advantages of flexibility, automated assembly, and reduced package size. This series has an ultra-low height profile that fulfills the demand for total size reduction and therefore facilitates system cost reduction requirements.

2020年8月25日 · Littelfuse/IXYS導入了一種新的封裝技術–表面黏著功率器件（SMPD）。 這個設計是ISOPLUS™封裝專利技術的延伸，這項專利技術提供電力電子行業的隔離封裝解決方案已有十多年的歷史了。 相較於一般銅的引線框架封裝，SMPD具有更好的熱性能，更輕的重量和更好的功率循環能力。 SMPD封裝可通過以下方式輕鬆地加工在印刷電路板（PCB）上： 標準的SMD加工和回流焊接製程. 無需昂貴的螺釘，電纜，母線或需要手工焊接的觸點。 重量僅重8克，與同 …

The new surface-mountable SMPD package is an ideal replacement part for bulky traditional power modules. IXYS is able to offer various SMPD topologies – the MMIX1F44N100Q3 is a single die 1000V/30A HiperFET™ Power MOSFET, the IXA68PF650LB a 1200V/68A dual IGBT with anti-parallel diodes, the DMA90U1800LB a 1800V/99A three phase rectifier ...

IXYS introduces a new packaging technology – the Surface Mount Power Device (SMPD) package. It is an expansion of the ISOPLUS™ package portfolio, which has been providing

The IXYS SMPD™ range provides a solution-scale package reducing material waste and lowering power footprint for all the power electronic applications of today and those of the future. Its platform flexibility and ease in assembly provides cost efficiency not just in terms of module cost but in the important processes of system

IXYS BiMOSFET系列3000V表面贴装功率器件 (SMPD) 封装是ISOPLUS™封装产品系列的扩展，包括可以采用标准表面贴装 (SMD) 焊接工艺进行组装，并且可以随时在客户现有的SMD装配线上以拾取贴装方式进行组装的模块。 SMPD系列在拓扑或硅片种类方面提供了大量标准选项。 诸多分立器件可以成功地组合在一个高可靠性封装中，然后在当前的SMD装配线上轻松组装。 超薄型紧凑型器件，非常适合用于替代笨重的传统 电源模块。 IXYS BiMOSFET系列3000V表面贴装 …

IXYS, a Littelfuse technology's 表面贴装功率器件 (SMPD) 系列是 MOSFET 功率器件，具有灵活性、自动化装配和更小封装尺寸等优点。该系列具有超小的高度，可满足减小总尺寸的需求，因此有助于降低系统成本。

The new surface-mountable SMPD package is an ideal replacement part for bulky traditional power modules. IXYS is able to oer various SMPD topologies – the MMIX1F44N100Q3 is a single die 1000V/30A HiperFET™ Power MOSFET, the IXA68PF650LB a 1200V/68A dual IGBT with anti-parallel diodes, the DMA90U1800LB a 1800V/99A three phase rectier diode.