2017年7月21日 · Yes, there are subtle differences that may or may not affect a particular design. For example, look at the specified package height from the bottom of the pins to the top of the body. Whether differences like these are "important" depend on your application. Never trust the manufacturer's package name.

The SOIC is taller (1.75mm vs. 1.2mm) which is enough to make a difference in a thin product. The lead pitch is much closer (almost half) on the TSSOP- 0.65mm vs. 1.27mm, so for crude manufacturing processes the SOIC might well be preferred.

2024年1月22日 · SOIC-16 Wide Body (DW) and Extra-Wide Body (DWW) Package Options It doesn't mention what DW stands for. I am annoyed when manufacturers come up with their own naming conventions without explaining clearly the accronymns or the logic behind the naming.

2013年1月28日 · In theory at least, SOIC is half the pin pitch of DIP and SSOP is half again. Thus SSOP is 0.1/4 = 0.025" or 0.635mm. Except I see many parts, from TI and Linear especially, which are SSOP (or TSSOP)

2023年6月9日 · It is an 8 pin SOIC package. When I try to assign a footprint for this package in KiCad, I am introduced with many choices: I am not sure which one to select, and neither do I know how to actually find the one I want. I am not sure what these numbers mean, or how to export that information from the datasheet.

2016年9月12日 · I was wondering whether it was not a better alternative to route the vias under the SOIC package (but still on the same layer) and place the feedback resistor above the op amp as shown below. This way the trace lengths are kept reasonably short, without using vias. But I guess if this was a better solution the author would have mentioned it.

2017年8月26日 · I have got a part in a SOIC-8 EP package. The "EP" indicates it is a package with a exposed pad which can transfer heat to the PCB. I would like to have a better understanding how much pcb surface I need to cool the part at different power consumption levels. Lets say 1 Watt 1/2 Watt and 0.1 Watt. I did read some white papers. They basically tell:

One of the PMICs I am utilizing is the TP4056 which is listed as being in a "SOP-8_EP_150mil" package. Doing a broader search on LCSC I came across this IC which listed its package as being "ESOP-8" and is slightly cheaper. I read through the Wikipedia listing for SOIC and their list of packages but I did not find any references to "ESOP".

2019年1月11日 · I have acquired some mcp-6002 op-amps in a SOIC package instead of the DIP I normally use. I have solder these to a SOIC to DIP "converter" so to fit on the breadboard. If I connect them as I do with the DIP (as simple buffers for testing) they don't seem to work, I tested 4 of these and all of them behave similarly, the upper part of the wave ...

DIP means dual inline package, was used mainly for thru hole components. I never used DIL. Like you understood DIP is a family. Letters added to it specify the package material, which is important during the assembly of circuit board and handling of the …