2003年4月3日 · 3D model - SOT883 (DFN1006-3) plastic, leadless ultra small package; 3 terminals; 0.35 mm pitch; 1 mm x 0.6 mm x 0.48 mm body

ÉÉ ÉÉ sot−883 (xdfn3), 1.0x0.6, 0.35p case 506cb issue a date 30 mar 2012 d 1 d 1

2024年4月21日 · Package Version Package Name 贴装 端子位置 封装风格 尺寸 終止計數 材料; SOT883: DFN1006-3: surface mount: bottom: SOT: 1.0 x 0.6 x 0.48: 3: plastic

Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to …

2024年9月10日 · SOT883: DFN1006-3: surface mount: bottom: SOT: 1.0 x 0.6 x 0.48: 3: plastic: Manufacture Code Reference Codes Issue Date; SOT883: SC-101(EIAJ: 2003-04-03 …

Nexperia SOT883 plastic, leadless ultra small package; 3 terminals; 0.35 mm pitch; 1 mm x 0.6 mm x 0.48 mm body Contents 1. Package summary.....1 2. Package outline.....2 3.

NTNS3C68NZ www.onsemi.com 4 TYPICAL CHARACTERISTICS Figure 7. Capacitance Variation Figure 8. Gate−to−Source and Drain−to−Source Voltage vs. Total Charge VDS, …

SOT883-3 Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.46 mm 20 May 2022 Package information 1. Package summary Terminal position code B (bottom) Package …

2011年6月30日 · plastic, leadless ultra small plastic package; 3 solder lands; 0.35 mm pitch; 1.0 mm x 0.6 mm x 0.37 mm body.

SOT-883-3 離散半導體 在Mouser Electronics有售。 Mouser提供SOT-883-3 離散半導體 的庫存、價格和資料表。