HC89F0531-SSOP24-T-M价格参考￥2.42。 holychip (芯圣电子) HC89F0531-SSOP24-T-M参数名称：CPU内核：51系列；CPU最大主频：16MHz；程序存储容量：32KB；程序存储器类 …

Title: Package Drawing - SSOP 24-Lead Plastic (5.3mm) 05-08-1640 Author: Linear Technology Corporation Keywords: Packaging Created Date: 7/25/2005 4:00:43 PM

Description: 24-LEAD SHRINK SMALL OUTLINE PACKAGE. Manufacturer: STMicroelectronics.

部件名: SSOP24. 下载. 文件大小: 59Kbytes. 页: 4 Pages. 功能描述: 24-LEAD SHRINK SMALL OUTLINE PACKAGE. 制造商: STMicroelectronics.

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension.

Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. On this page you can find the dimensions and packing method for Toshiba Semiconductor's SSOP24_linear package.

On this page you can find the dimensions and packing method for Toshiba Semiconductor's SSOP24-P-300-0.65A package.

Shrink Small Outline Package SSOP DIP Adapters Analog Devices: RQ-16: 60Kb / 1P: 16-Lead Shrink Small Outline Package [QSOP] Dimensions shown in inches ... SOT340-1: 11Kb / 1P: SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm 2003 Mar 24: Guangdong Youtai Semico... LM75B: 312Kb / 23P: plastic thin shrink small outline ...

型号： bs83b16a-3(ssop-24) 品牌： holtek; 封装： ssop-24_8.66x3.9mm; 描述： 触控式 flash 单片机 ssop24_8.66x3.9mm

Download (Package dimension, Taping specification, Taping reels dimension, Power dissipation and Land pattern (Foot pattern)) Package information.