BERGQUIST GAP FILLER TGF 1500 is a 2-part, high performance, thermally conductive liquid gap filler featuring superior slump resistance and high shear thinning characteristics for optimized consistency and control during dispensing. The mixed system will cure at room temperature, or faster with the addition of heat.

BERGQUIST® GAP FILLER TGF 1500LVO is a 1.5 W/m-K thermally conductive, ultra-conforming, silicone-based liquid gap filler (2-part). It offers high temperature resistance and is proven to have significantly lower levels of silicone outgassing.

BERGQUIST GAP FILLER TGF 1500 is a two-part, high performance, thermally conductive liquid gap filling material, which features superior slump resistance and high shear thinning characteristics for optimized consistency and control during dispensing. The mixed system will cure at room temperature and can be accelerated with the addition of heat.

2025年2月16日 · 化学稳定性bergquist gap filler tgf 1500 是一种由两部分组成的高性能,导热液体间隙填充材料,具有 的抗坍落性和高剪切力用于优化一致性和控制的细化特性在分配过程中。

Bergquist Gap Filler 1500 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for fragile electronic assemblies and filling difficult air voids and gaps. It offers excellent shear thinning characteristics, slump resistance, mechanical and chemical stability.

bergquist® gap filler tgf 1500是一款双组份、具有高性能的导热液态间隙填充材料，具有优异的抗塌落性和高剪切稀化的特性，可优化点胶期间的均匀性和控制。

BERGQUIST GAP FILLER TGF 1500 is a 2-part, high performance, thermally conductive liquid gap filler featuring superior slump resistance and high shear thinning characteristics for optimized consistency and control during dispensing. The mixed system will cure at room temperature, or faster with the addition of heat.

2024年10月25日 · 汉高BERGQUIST GAP FILLER TGF 1500 是一种高性能的隙填充材料，主要用于电子和电气设备的组装过程中，以填补组件之间的空隙，提供良好的电气绝缘和机械稳定性。 以下是对该产品的一些简介： 1. 产品特性： - 优异的抗塌落性：即使在垂直或倾斜的表面上也能保持形状，不会流动或塌落。 - 良好的粘接性：与多种材料（如塑料、金属和陶瓷）具有良好的粘接性能。 - 高弹性：在受到机械应力后能够恢复原状，减少应力集中。 - 耐热性：能够在较高的温 …

BERGQUIST® GAP FILLER TGF 1500 is a two-part, high performance, thermally conductive liquid gap filling material, which features superior slump resistance and high shear thinning characteristics for optimized consistency and control during dispensing.

BERGQUIST GAP FILLER TGF 1500 is a two-part, high performance, thermally conductive liquid gap filling material, which features superior slump resistance and high shear thinning characteristics for optimized consistency and control during dispensing. The mixed system will cure at room temperature and can be accelerated with the addition of heat.