2023年9月18日 · In particular, Intel is talking about <5/5um Line/Space and <100um through-glass via (TGV) pitch, which enables die-to-die bump pitch of <36um on substrate and core bump pitch <80um.

玻璃通孔(Through-Glass Via, TGV)互连技术最早可追溯至2008年, 衍生于2.5D/3D集成TSV转接板技术, 主要用来解决TSV转接板由于硅衬底损耗带来高频或高速信号传输特性退化、材料成本高与工艺复杂等问题。

2023年10月23日 · TGV, an essential method for glass substrates to achieve 2.5D/3D packaging, involves internal modification for subsequent wet etching processes. Currently, the most common TGV method uses a...

2023年9月24日 · 为了缩小机械和电气之间的差距，通过基板本身传输信号的玻璃通孔（TGV）上实现更紧密的间距,使通孔的总体数量大大增加。据intel报告，他们能够将TGV的间距控制在100µm以内,从而将TGV密度提高10倍。

2023年9月18日 · Intel Glass Substrate 2023 Advanced Packaging Options. The Glass Core Substrate will do things like improve power delivery and get high-efficiency I/O on the package. Intel also is planning a glass-based coupling with integrated waveguides for the pluggable co-packaged optics that were shown at Intel Innovation 2022.

2023年10月20日 · On September 19, 2023, Intel announced one of the industry’s first glass substrates for next-generation advanced packaging. The industry believes that glass substrates are emerging as a promising alternative interposer material, especially for heterogeneous packaging such as 2.5D or 3D packages.

Intel Product Update • Intel work on glass goes back a decade • Fully integrated glass R&D line with over $1B investment in Chandler, AZ • Close work with equipment and materials partners to enable ecosystem • Electrically functional assembled MCP test vehicle with 3 …

2023年12月28日 · The TGV process provides the fabrication and metallization of high-density, high-aspect-ratio glass vias, enabling a reduction in device size while maintaining high-performance electrical interconnects. Intel says glass substrate technology can increase the chip area in a single package by 50%, allowing more chiplets to be crammed in.

2023年5月4日 · tgv衬底垂直导通柱即为由回流玻璃隔离出来的硅柱，衬底上不制作金属电极，直接用硅做电极。 硅结构层采用Silicon-on-Insulator (SOI)材料和干法刻蚀制作而成，空腔制作在硅可动结构层上，通过硅-玻璃将三者阳极键合在一起，分别有两次，形成密封环境。

TGV将助力英特尔超越Intel 18A制程节点，达成2030年之前在单一封装中提供1万亿个晶体管的宏愿。 TGV，Through Glass Via，是穿过玻璃基板的垂直电气互连。 与TSV（Through Silicon Via）相对应，作为一种可能替代硅基板的材料被认为是下一代三维集成的关键技术。 TGV 以高品质硼硅玻璃、石英玻璃为基材，通过种子层溅射、电镀填充、化学机械平坦化、RDL再布线，bump工艺引出实现3D互联。 TGV是直径通常为10μm-100μm的微通孔。 对于先进封装领 …