2021年7月13日 · 这里介绍的TLP测试系统 Barth 4002 是一种TDR-O系统，在测试过程中所得的曲线通过传输线的入射波和反射波叠加而成，测得的初始数据为瞬态脉冲下电压-电流关于时间的特性。

2011年8月1日 · Transient liquid phase (TLP) bonding is a relatively new bonding process that joins materials using an interlayer. On heating, the interlayer melts and the interlayer element (or a constituent of an alloy interlayer) diffuses into the …

The Master of Arts in Teaching (MAT) and Teacher Licensure Programs (TLP) in Secondary Education have been designed for students who wish to obtain initial teacher licensure as part of a Master’s Degree, or licensure only.

2024年3月8日 · Last night the trust received recognition at the National MAT Awards, being awarded the MAT Leadership Team of the year. In receiving the award the trust and its leadership team were recognised for "outstanding in achievement, collaboration and overcoming adversity" in what was a hotly contested category, with 7 shortlisted MATs from across the ...

TLP接合 (液相扩散接合 (※1))：Transient Liquid Phase Diffusion Bonding. 接合后,由于Ag和Sn变成Ag 3 Sn,耐热温度升至480℃,具有比现有材料更高的耐热性。 接合强度维持最大50MPa，即使在300℃也能维持相同的接合强度。 还具有通过了3,000次热循环测试的较高接合可靠性的特长。 由于可在几分钟内完成接合，可通过减少节拍时间来降低制程成本。 由于是不含溶剂的材料，不会产生VOC (挥发性有机化合物)。 由于不含铅，因此不含Rohs限制对象物质。 可在250℃的加热 …

Transient liquid phase (TLP) bonding is a joining process that has been applied to many metallic systems throughout the ages, and yet it still holds promise as a technique for joining in aerospace and semiconductor applications. The TLP process produces a strong, interface-free joint with no remnant of the bonding agent.

The TLPS is a novel PM technique typically used for forming bulk materials consisting of ceramics, various metals, and metal matrix-ceramic composites. For example, TLP sintering of Fe-C powders with yttria-stabilized zirconia (YSZ), SiC, or Al 2 O 3 particles can be used to form ceramic-reinforced steel-matrix composites having near-net shape ...

Compared to other bonding technologies, TLP is an advanced type of solder bonding method that can form hermetic sealing at lower temperatures. It is ideal for MEMS vacuum packaging, as the process can be performed at low temperatures compatible with CMOS standards and the resulting bonded devices can withstand harsh environments with high ...

Zhou, Y. Analytical modeling of isothermal solidification during transient liquid phase (TLP) bonding. Journal of Materials Science Letters 20, 841–844 (2001). …

2012年9月1日 · Optimization of transient liquid phase (TLP) bonding variables is essential to achieve a joint free from deleterious intermetallic constituents as well as with appropriate mechanical properties. In this research, TLP bonding of FSX-414 superalloy was performed using the MBF-80 interlayer.