TMV is proud to partner with Backroom to supply products to the rail, marine, and public transit industries in Brazil.

Available in both 40 and 50 typers, the grease lubricated cartridge spindles are liquid cooled. The spindle reduces thermal deformation and extends spindle life. Standard 8,000 rpm belt-driven 40 taper spindle can optionally be changed to 10,000 rpm for high speed machining.

The five-machine series of Tongtai TMV 40/50 taper series high-speed vertical machining centers combine speed, rigidity and precision. Large NSK linear ways on all axes with large diameter pre-tensioned ballscrews, and a large diameter rigid spindle facilitate heavy cutting in both 40 and 50 taper applications.

2007 Tongtai TOPPER TMV-850A Vertical Machining Center. Control: Fanuc OiM X Axis Travel: 33.5" Y Axis Travel: 19.7" Z Axis Travel: 20.9" Table Size: 37" x 20" Table Load: 1,100 LBS Spindle Speed: 8,000 RPM Spindle Taper: CAT 40 Spindle Motor: 10 HP Tool Capacity: 24 ATC . REQUEST A QUOTE FOR THIS MACHINE. Go back to the home page ----} HOME PAGE

TOPPER TMV 400 Vertical machine centre new 2001. used. Manufacturer: Topper; ATC with 8 positions, please note the machine viuce is not included in price.

View our options for CNC Vertical Lathe Machine. Taiwan You Ji Machinery has been designing and manufacturing machine tools for more than 40 years.

烟草花叶病毒（TMV）是烟草花叶病毒属中的一种单链正义RNA病毒，可感染多种植物，尤其是烟草和茄科的其他成员。 感染会导致特征性的模式，例如“马赛克”样的斑点和叶子变色 (因此得名)。 TMV是第一个被发现的病毒。 尽管从19世纪末开始知道一种非细菌性传染病正在破坏烟草作物，但是直到1930年，这种传染病才被确定为病毒。 它是第一种被鉴定为病毒的病原体。 历史. 1886年，阿道夫·梅耶（Adolf Mayer）首次描述了烟草花叶病，这种疾病可在植物之间传播， …

(2013) TMV-1050A CNC vertical machining center with FANUC SERIES 0i-MD CNC control, 42.8”x19.4” table, travels: X – 41.3”; Y – 19.68”; Z – 20.87”, 24.8” max. distance spindle nose

The TMV team places founders and teams first, stays true to their mission and is everything we could ask for in an investor. TMV has always stood in partnership with our team with spot-on advice, go-to-market expertise and direct support from their platform team.

2023年1月20日 · 垂直互连是晶圆级封装中实现3d高密度互连的关键技术。常见的垂直互连结构有tsv（through silicon via，硅通孔）、tgv（through glass via，玻璃通孔）、和tmv（through molding via，塑封通孔）。其中tmv的制作成本最低，工艺流程最短，技术难度最低。