The TO-267 is a type of "transistor outline" package that features a metallic body with a flat metal tab at its back (see Figure 1) to enable it to dissipate large amounts of heat. The TO-267 looks very similar to the TO-257, but it is larger than the latter.

【2023年7月3日，德国慕尼黑讯】 英飞凌推出采用TO263-7封装的新一代车规级1200 V CoolSiC™ MOSFET。 这款新一代车规级碳化硅（SiC）MOSFET具有高功率密度和效率，能够实现双向充电功能，并显著降低了车载充电（OBC）和DC-DC应用的系统成本。 相比第一代产品，1200 V CoolSiC系列的开关损耗降低了25%，具有同类最佳的开关性能。 这种开关性能上的改进实现了高频运行，缩小了系统尺寸并提高了功率密度。 由于栅极-源极阈值电压（VGS (th)） …

TO-267 . Hermetic Flange Mounted Header Family . TO-268 . Surface Mounted Header R-PSFM-G2 . TO-269 . Small Outline Surface Mount 4 Lead . TO-270 . Two Lead Surface Mount Power Package . TO-271 . Quad Flat Pack Surface Mount Thermally Enhanced Pkg. JEDEC Publication No. 95 . TRANSISTORS OUTLINES (TO) Contents -iii-

Mouser提供TO-263-7 碳化硅MOSFET 的库存、定价和数据表。

HIGH CURRENT MOSFET IN ISOLATED, TO-267 HERMETIC PACKAGE, SIZE 7 DIE, LOW RDS(on) FEATURES • Isolated Hermetic Metal Package • Size 7 Die, High Energy • Fast Switching, Low Drive Current • Ease Of Paralleling For Added Power • Low RDS(on) • Available Screened To MIL-S-19500, TX, TXV And S Levels DESCRIPTION

TO-263-7 MOSFETs are available at Mouser Electronics. Mouser offers inventory, pricing, & datasheets for TO-263-7 MOSFETs.

ROHM Semiconductor 扩展了其独立碳化硅 (SiC) MOSFET 产品组合，现可提供 TO-263-7L SMD 封装的器件，实现更快速的开关与更低损耗。

TO-92 is an insertion-mount package with a lead pitch of 1.27mm. The longer package type is called " TO-92MOD ". Alternatively, TO-92 is sometimes referred to as " TO-226AA " for JEDEC standard. TO-92 is used for "3-terminal devices such as transistors and thyristors" and "ICs with a small number of leads such as voltage regulators".

Jun 19, 2021 · 本图仅供参考!因现在很多生产商发布封装尺寸不尽统一,我们也不能一一录入,只是尽力挑选有代表性的封装图片来参考.另外封装后面有“EP”结尾的是指底部带有散热片的。 还有TSOT与SOT的差别，据分析TSOT的耗散功率较SOT的大些，有的人说TSOT厚度更厚一些，但也有例外，如AD公司的TSOT是薄的。