The TO-3 case has a flat surface which can be attached to a heatsink, normally via a thermally conductive but electrically insulating washer. The design originated at Motorola around 1955 from a group headed by Dr. Virgil E. Bottom.

2 Lead TO-3 Metal Can Package, Aluminum NS Package Number KC02A

2020年11月1日 · I am trying to build a circuit for a power amplifier and TO-204AA is the packaging used in the circuit diagram. KiCad does not have TO-204AA but it has TO-3. Looking at the image below you will see that there is a difference of approximately +- 0.45 millimeters between the two packages. Is this a lot? Will it matter if I exchange the two?

The true case temperature is located directly below the sub-strate and centered within the package pins (see Figure 5). This location, called the case backside, will also give the most repeatable measurements. To directly access the case back-side, drill the heat sink with the optional thermocouple hole(7) as illustrated in Figure 2.

2025年3月5日 · Replace a TO-3 transistor with your choice of TO-3P or TO-247 transistor without compromising thermal performance! Test results here. Looks cool too. Adapters are solid copper, 1.6mm thick. Transistor is soldered to the adapter, SMD-style. (You’ll need a hot-air soldering station. It’s easy!)

Shaded areas indicate Darlington. † Uses 60 mil leads.See mechanical specifications on page 209

2008年3月15日 · Metal case offers much more thermal stability than plastic case devices. If the ambient temperature is more than normal, TO-3 case devices always offer an edge over plastic devices. It's way easier to mount a big TO-264 and you get …

TO-3 is a family of large through-hole metal can packages used for things such as transistors, linear regulators and op-amps. There are 2 lead (common), 3 lead (common), 8 lead (rare), and 15 lead (very rare) variants.

Nylon Case Covers for TO-3 Transistor Sockets. Molded nylon covers easily mount over and insulate the power transistor.Will withstand temperatures to approximately 250 °F (107°C).

The TO-3 or TO3 is a type of 'metal can' package that is capable of high-power dissipation commonly used by power transistors, SCR's and other high-power semiconductor devices. The TO-3 is made entirely of metal, with the microchip mounted on its metal can base and then covered with a metal cap.