The Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads.

Package Outline Dimensions PG-TSSOP-8-1 Share. 01_00 | Jul 11, 2017 | PDF | 83 kb. Board Assembly Recommendations (Gullwing) Share. 05_00 | Nov 12, 2020 | PDF | 2.03 mb. 3D …

TSSOP-8 package, MOSFETs manufactured by Vishay, a global leader for semiconductors and passive electronic components.

TSSOP-8 EEPROM are available at Mouser Electronics. Mouser offers inventory, pricing, & datasheets for TSSOP-8 EEPROM.

2020年11月12日 · P-TSSOP-8-800_Package Outline_02 Share. 01_00 | Feb 13, 2024 | PDF | 104 kb. Packing. P-TSSOP-8-800_Tape and Reel Share. 01_00 | Nov 18, 2023 | PDF | 104 …

The TSSOP-8 package has 45% less footprint area than the standard SO-8. This makes the TSSOP-8 an ideal device for applications where printed circuit board space is at a premium. …

FOOT TSSOP-8 MOSFETs have a smaller footprint and a lower profile than LITTLE FOOT SOICs, while maintaining low rDS(on) and high thermal performance. Vishay Siliconix has …

TSSOP-8 C3 Dimensions Value (in mm) X 0.45 Y 1.78 C1 7.72 C2 0.65 C3 4.16 G 0.20 Y C1 X C2 G L See Detail C D E A1 A A2 e a Detail C E1 b D c. Author: Roseanna haney Created Date:

DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR …

2020年11月12日 · Package. PG-TSSOP-8-801_Package Outline Share. 01_00 | Oct 14, 2023 | PDF | 104 kb. Board Assembly Recommendations (Gullwing) Share 05_00 | Nov 12, 2020 | …