The Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads.

Shrink small-outline package (SSOP) chips have "gull wing" leads protruding from the two long sides, and a lead spacing of 0.65 mm (0.0256 inches) or 0.635 mm (0.025 inches ).

2023年10月2日 · SSOP封装间距主要是0.65mm规格的吗，也有一些封装是0.635mm规格的，比如16P；宽度主要是5.3mm和3.81mm两种规格。 常用的SSOP封装以及相应的封装体宽度主要有以下： 以上基本就把SO系列封装的全部信息阐述完了，希望上文对大家有所帮助。 文章浏览阅读3.7w次，点赞27次，收藏131次。 1. 简要信息如下：2.

Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm). They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume.

2018年3月28日 · 在EIAJ 标准中，针脚间距为1.27mm (50mil)的此类封装被称为“SOP”。 请注意，JEDEC 标准中所称的“SOP”具有不同的宽度。 缩小外形封装，厚度正常,脚是密脚的。 薄小外形封装，薄体的脚，间距正常的。 薄的缩小外形封装，薄体的脚是密脚的。 按照JEDEC 标准对SOP 所采用的名称。 J 形引脚小外型封装。 芯片里的 有什么？ 和 能否兼容？

TSOP适合用SMT（表面安装）技术在PCB上安装布线。 TSOP封装外形，寄生参数（电流大幅度变化时，引起输出电压扰动）减小，适合高频应用，操作比较方便，可靠性也比较高。 第五种：PLCC（Plastic Leaded Chip Carrier） PLCC，即塑封J引线芯片封装。

Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads. They are suited for applications requiring 1 mm or less mounted height and are commonly used in analog and operation amplifiers, controllers and Drivers, Logic, Memory, and RF/Wireless, Disk drives, video/audio ...

SD2068-TSSOP8由WAVE (兴威帆电子)设计生产，立创商城现货销售。 SD2068-TSSOP8价格参考￥1.87。 下载SD2068-TSSOP8中文资料、引脚图、Datasheet数据手册，有实时时钟 (RTC)详细引脚图及功能的应用电路图电压和使用方法及教程。

The TSSOP logic portfolio comprises functions in 14-, 16-, 20-, and 24- pin packages as well as 16-bit functions in 48- 56- and 64-pin packages. They are surface mount packages with gull-wing pins. Pin pitch is typically 0.65 mm. TSSOP packages provide 35 to 65 % space saving compared to SOIC solutions. Profile height is 35 % less than SOIC ...

Download the datasheet for TSSOP part from STATS ChipPAC. Detailed specifications and information are available.