2021年8月22日 · Via plugging is a process in which vias are completely filled with resin or closed with a solder mask. This technique is different from via tenting where resin/solder mask doesn’t fill the via hole but just provides a covering.

Via plug is more and more commonly used in high standard PCBs, especially the ones with BGA assembly. Viasion offers a variety of via plug requirement in our PCB production, such as vias tented by solder mask, vias plugged/filled by solder mask, vias plugged by conductive and non-conductive material, vias plated shut by copper (via-in-pad) etc.

2025年1月8日 · Plug-1 形成的主要步骤. 金属淀积 Ti 阻挡层（PVD） 在薄膜区利用 PVD 设备在整个硅片表面淀积一薄层 Ti。Ti 衬垫于通孔的底部及侧壁上。Ti 充当了将钨限制在通孔当中的粘合剂 ; 淀积氮化钛（CVD) 在 Ti 的上表面淀积一薄层氮化钛。

via的金属填充，即可导电又可导热，具有十分重要的作用。 contact与via的区别. 功能与位置不同： Contact是连接硅和第一金属互连层的。而Via被用来连接金属层之间的电连接。它可以连接第一层和第二层的金属，或第二层和第三层的金属等。 尺寸不同：

5 天之前 · Via plugging is a process where the via hole is completely filled with a material to seal it. This material can be either conductive or non-conductive, depending on the specific requirements of the design.Via plugging is typically used to prevent solder contamination, strengthen the via, and ensure the stability of active pads—especially in …

Via Filled and Capped Technology is mostly used for Via-in-Pad (VIP) solutions and is also applied for stacked and staggered via & microvia in HDI boards. Via plugging facilitates routing of additional conductor traces between BGA vias amongst other things.

2021年10月15日 · Via指互连线通孔，芯片的连线有不同层的金属互连线相互连接。而Via的作用就是连接这些不同层的金属。如下图所示： 一个完整的通孔是由三层组成的，包括两个互连层和一个cut层，cut层可以理解为连接两层互连线的接口。

2019年1月1日 · 导电孔Via hole又名导通孔，为了达到客户要求，导通孔必须塞孔，经过大量的实践，改变传统的铝片塞孔工艺，用白网完成板面阻焊与塞孔。生产稳定，质量可靠。

2021年5月23日 · Via hole protection is a PCB manufacturing technique in which the via hole is filled with solder mask or epoxy. This process partially or completely closes the via hole using a conductive or non-conductive filling material.

金属钛阻挡层淀积（PVD） 与其它金属工艺一样，钛是淀积于整个硅片上的第一层金属。它提供了Plug和下一层Metal之间的良好键合。同样它与ILD材料的结合也非常紧密，提高了金属叠加结构的稳定性