2018年1月1日 · Slicing silicon wafers for solar cells and micro-electronic applications by diamond wire sawing has emerged as a sustainable manufacturing process with higher productivity, reduced kerf-loss, thinner substrates that save material, and reduced environmental impact through the use of water-based cutting fluids, compared to the conventional loose a...

2025年3月28日 · Wafer Separation: The silicon ingot is sliced into wafers of precise thickness (例如, 180 µm for solar wafers). 3. Advantages of Diamond Wire Saw Cutting. Compared to older methods like multi-wire slurry saws (MWSS), DWS offers: 3.1 Higher Cutting Speed & 效率 . – Cutting speeds up to 1.5x faster than slurry-based methods.

Diamond wire sawing (DWS) is an emerging technology for wafering semiconductor ingots, which promises many advantages over the existing dominant technology of slurry cutting [1,2,3].

2025年3月1日 · Diamond wire sawing (DWS) has emerged as a promising technological advancement in wafer manufacturing, surpassing traditional free abrasive wire sawing methods. This technique enables slicing hard and brittle materials like silicon and silicon carbide to achieve ultra-thin wafers and high surface quality [1] , [2] , [3] .

2022年6月8日 · Diamond wire sawn (DWS) multi-crystalline (mc) silicon wafers for solar cells are known to be difficult to texturize with the conventional wet acidic etching technology.

6 天之前 · Monocrystalline silicon is widely used in the semiconductor industry. During wafer machining with a diamond wire saw (DWS), a worn diamond wire can affect the slicing quality. To assess the effect of diamond wire wear on wafer machining, in this study, the impact of diamond wire wear on the wafer’s total thickness variation (TTV) and surface quality was examined at a wire velocity of 1.8 m/s ...

2020年10月1日 · Grinding as a pre-treatment method for HF-HNO 3 -H 2 O solution etching of diamond wire sawn (DWS) multi-crystalline (multi-Si) silicon wafers was proposed and researched. Significant improvement in morphological uniformity and decrease in light reflectivity of the wet acid etched surface textures were achieved with the pre-treatment.

2016年12月1日 · In this paper, we presented a novel low-cost method for diamond-wire-sawn (DWS) multicrystalline silicon (mc-Si) wafer texturation based on the metal-assisted chemical etching process with Ag/Cu dual elements and nanostructure rebuilding (NSR) treatment to remove the saw marks and to realize uniform invert pyramid textured structures.

2020年11月9日 · Abstract: The introduction of diamond wire sawing (DWS) technology has resulted in significant cost reduction in the fabrication of crystalline silicon wafers. However, the DWS process results in parallel wheel marks, saw damage, and formation of an amorphous silicon layer on the surface, which causes difficultly in effectively forming the ...

2025年1月12日 · The nucleation process of pyramids differs between slurry-cut and diamond wire saw (DWS) wafers due to distinct surface morphologies, with DWS wafers presenting smooth grooves that mirror the cutting wire pattern and often retaining a layer of amorphous silicon .