工作熊個人將這種焊錫被焊腳吸走的不良現象稱之為【焊錫燈芯虹吸效應(Solder Wicking Effect)】，用來與PCB滲銅的「燈芯效應(wicking effect)」作區別。 再強調一次這不是正式名稱。

Wicking occurs when the copper from a plated-through hole (PTH) extends along the glass fiber fabric. Why is this important? This results in intermittent electrical shorts or complete shorts due to bias driven migration of copper towards non-common conductors. Ensure sufficient resin wet-out of glass fibers (siloxane treatment). 4.

电子制造业中的“灯芯效应”一般指PCB基板在机械钻孔制作PTH及via时，容易因为振动摩擦产生高热融化树脂与钻头高速旋转的撕扯力道而造成玻璃纤维纱束中纤维与纤维间绽开，在后续的电镀铜作业时，液态铜会沿着这些基板纤维间裂开的缝隙而发生浸透的现象 ...

2024年12月18日 · Learn about PCB wicking, its causes, and how it impacts circuit performance. Discover prevention methods for PCB manufacturing.

【焊锡灯芯虹吸效应(Solder Wicking Effect)】通常用来说明PCBA焊锡过程中PCB焊盘上的锡膏融化润湿后沿着零件引脚的表面金属往上爬升的现象，它会造成焊盘上的焊料不足，严重者形成空焊(non-wetting)或在相邻引脚间发生架桥短路(solder bridge)。

我們回來說說這【焊錫燈芯虹吸效應(Solder Wicking Effect)】不良現象，這種現象基本上發生在焊錫的潤濕(wetting)過程中，已經融熔的焊料沿著零件焊腳向上爬升，造成焊墊上的焊錫不足或過多焊錫聚集於焊腳的肩部互相擠壓後與相鄰焊腳間產生架橋短路現象。

因pcb基材中玻璃纤维纱缺少树脂的填充或者有孔隙，在进行导通孔的电镀过程中，铜离子往玻璃纤维纱方向渗透，使玻璃纤维纱之间的孔隙中有铜的填充，该现象即为灯芯效应

2024年2月6日 · 電子製造業中的「燈芯效應(wicking effect)」一般指的是PCB基板在機械鑽孔(簡稱「機鑽」)製作PTH及via孔時，容易因為振動摩擦產生高熱融化樹脂。 另外，鑽頭高速旋轉的撕扯力道也會造成玻璃纖維紗束中纖維與纖維間炸開。

2024年10月25日 · Solder wicking is a phenomenon frequently encountered in the assembly of printed circuit boards (PCBs). It involves the unintended movement of molten solder away from the intended joint or connection point, which can lead to various issues, including poor electrical connectivity, mechanical reliability problems, and compromised performance of ...

2025年2月7日 · Solder wicking is a term used to describe the uncontrolled flow of solder from its intended location—typically component pads and leads—into unintended areas such as vias, traces, or even the surface of nearby components. This solder migration usually happens during the soldering process when heat is applied, and the solder is in its liquid state.