Abstract: This study introduces a novel hybrid p-doping strategy, integrating tungsten oxide (WO x) charge transfer and nitric oxide (NO) molecular doping with wafer-scale CVD grown monolayer tungsten diselenide (1L-WSe 2).

Large-area synthesis of WSe 2 on polyimide (30 × 40 cm 2) flexible substrates and 8 in. silicon wafers with good uniformity was demonstrated at the formation temperature of 250 °C confirmed by Raman and X-ray photoelectron (XPS) spectroscopy.

Large-area synthesis of WSe2 on polyimide (30 × 40 cm2) flexible substrates and 8 in. silicon wafers with good uniformity was demonstrated at the formation temperature of 250 °C confirmed by Raman and X-ray photoelectron (XPS) spectroscopy.

Scalable synthesis of thin tungsten diselenide (WSe 2) films on 4-inch silicon substrate with 80 nm silicon dioxide (SiO 2) is demonstrated. Cross-sectional transmission electron microscopy (TEM) reveals good control of WSe 2 layers. Raman spectroscopy confirms high quality crystal of …

晶圆（Wafer）键合技术是一种将两个或多个晶圆（Wafer）通过特定的工艺方法紧密地结合在一起的技术，以实现更高性能、更小型化的电子元器件。 所以，本期要跟大家分享的是晶圆（Wafer）键合设备的结构、工作原理以及晶圆（Wafer）键合工艺的流程、特点和 ...

2021年4月21日 · 4月20日，Cerebras Systems 公司再次刷新历史，推出为超级计算机任务而打造的第 2 代 Wafer Scale Engine （WSE-2）芯片。 与一代WSE相比，WSE-2虽然在面积上没有变化，但却拥有创纪录的 2.6 万亿个晶体管以及 85万个 AI 优化的内核，芯片的所有性能特征，包括：晶体管数、内核数、内存、内存带宽和结构带宽，均比一代增加了一倍以上。 差不多两年前（2019年8月），SeaMicro 创始人安德鲁·费尔德曼（Andrew Feldman）创办的 Cerebras …

2023年2月27日 · Here, we propose a simple selenization approach to grow wafer-scale (2 in.) 2D p-WSe 2 layers with high uniformity and customized patterns. Furthermore, a self-driven broadband photodetector with a p -WSe 2 / n -Si van der Waals heterojunction has been in situ fabricated with a satisfactory responsivity of 689.8 mA/W and a large specific ...

2025年2月3日 · Here we report the fabrication of indium selenide (InSe) semiconductor thin films using a colloidal solution of monolayer nanosheets (monolayer purity more than 98%). The InSe thin films are...

2015年12月31日 · The synthesis of few-layer tungsten diselenide (WSe2) via chemical vapor deposition typically results in highly non-uniform thickness due to nucleation initiated growth of triangular domains. In this work, few-layer p-type WSe2 with wafer-scale thickness and electrical uniformity is synthesized through direc

Cerebras CS-3 系统是第三代的晶圆级（Wafer Scale）系统。 它具备顶部 MTP/MPO 光纤连接，并带有用于冷却的电源、风扇和备用泵。 需要为大型芯片提供电力、数据和冷却，并要管理热膨胀等问题。