Glenbrook offers advanced real-time X-ray technology to evaluate solder joint integrity for BGAs and other leadless packages that standard imaging systems cannot inspect. Glenbrook’s patented X-ray camera provides a unique advantage: it is the only system not subject to voltage blooming.

X射线检测装备通过X射线的实时成像技术，实现对BGA器件焊接焊点的质量检验，X射线不能穿透锡、铅等密度大且厚的物质，所以可形成深色影像，而X射线可以轻易穿透印制板及塑料封装等密度小且薄的物质，不会形成影像，这样的现象就可以从影像中判别BGA的焊接质量。 广州市昊志影像科技有限公司，新一代X射线成像系统及核心部件。 BGA检测需要对内部缺陷进行透视检查，而普通的外观检测或者 AOI 及人工检查无法对解决BGA的内部缺陷问题， X-RAY 属于透视无损 …

New X-ray sources, detectors, and ergonomic features improve the efficiency and productivity of the inspection process. This paper reviews the methods of finding defects in BGAs, QFNs, and 3D packages using X-Ray inspection with real-life examples provided. Voiding, cracks, shorts, open joints, and head in pillow (HIP) will be discussed.

2012年6月20日 · How do we do a precise inspection of BGA solder quality? The answer is, using X-ray inspection. An X-ray inspection system consists of an X-ray chamber in which an electronic board is placed and an X-ray camera that produces X-ray images of the inspected BGA IC on to an interfaced computer.

This paper is a study using two different X-ray Inspection systems – one a Laminography and the other a transmission type – to inspect BGA joints that exhibit voids. These two X-ray systems were used purely as a means of measuring the size of the voids within the BGA ball.

2015年12月1日 · After several years of experience using BGAs, reports from the field have identified four major categories of defects common to BGAs, all of which can be identifies with x-ray inspection. The first type is missing solder balls (Figure 1). Assemblers report that it is not uncommon for these tiny spheres to become dislodged during the handling ...

A BGA X-ray inspection is the most sophisticated technology for inspecting BGAs. X-rays operate by projecting X-ray energy onto the board from an X-ray tube. Different amounts of X-rays penetrate the board.

Utilizing a genuine 3D CT method, defects such as Voiding, Non-Wetting, and Head-in-Pillow are distinctly visible, enabling engineers to conduct accurate root-cause analyses. 3D CT X-Ray inspection offers exceptional clarity when comparing defects against IPC standards and removes many of the visible obstructions introduced by other advanced X-R...

2020年11月11日 · X-ray inspection for BGA. The BGA solder joint bonds are inspected using X-rays. The X-ray inspection helps to look through the device solder joint underneath the components. Due to this ability, the Automated X-ray Inspection (AXI) technology is widely used for BGA inspection.

Effective BGA X-ray inspection is vital for ensuring the reliability of electronic assemblies. By understanding common defects such as short circuits, open connections, solder mask issues, and alignment problems, and utilizing advanced x-ray techniques like 2.5D views, you can improve the quality and performance of your assemblies.