Dragon XP8 is a high-productivity 300mm tool for PECVD applications. The Dragon XP8 PECVD system can be configured with up to four Dual Chamber Modules (DCM) enabling eight chambers in high-volume production within a very compact footprint.

Eagle XP8 is a high-productivity 300mm tool for plasma-enhanced ALD (PEALD) applications. The Eagle XP8 PEALD system can be configured with up to four Dual Chamber Modules (DCM), enabling eight chambers in high volume production within a very compact footprint.

Eagle XP8 is a high-productivity 300mm tool for plasma-enhanced ALD (PEALD) applications. The Eagle XP8 PEALD system can be configured with up to four Dual Chamber Modules (DCM), enabling eight chambers in high volume production within a very compact footprint.

2019年1月23日 · The QCM chambers use the same advanced reactor technology as ASM's original PEALD and PECVD XP8 Dual Chamber Modules (DCMs). Hundreds of these DCMs have been running for years in high-volume production globally at …

ASM Eagle XP8 • Manufacturer: ASM • Model: Eagle XP • Wafer Size: 300mm • Platform: ASM XP8 CVD o XP8 platform includes: AFE, FERB and BERB o 4 Load Ports (SINFONIA N2 Purge) is baseline o Excludes: Notch Aligner • Software Version: 2.00h • Robots: o FERBT – Kawasaki o BERBT – Brooks MAG8 • Chambers: XP8 o CDTch only contains ...

ASM Eagle XP8 Plasma Enhanced ALD Tool • Manufacturer: ASM International • Model: Eagle XP8 • Wafer Size: 300mm • XP8 Platform • Front and rear Operations/Maintenance Touch Screen with pen • Loader module transfer robot and controller with 3 load ports. • 2 Load locks • Wafer cooling chamber

The system can be configured with up to four Dual Chamber Modules (DCM), enabling eight chambers in high-volume production within a very compact footprint. Processes include a broad range of dielectric PECVD films for applications such as interconnect dielectrics layers, passivation layers, and etch stop layers

XP8 QCM is a 300mm tool for high-productivity plasma enhanced atomic layer deposition (PEALD) for advanced node memory and logic applications. The QCM, or Quad Chamber Module, is a process module with four tightly integrated process reactors.

Eagle XP8 is a high-productivity 300mm tool for plasma-enhanced ALD (PEALD) applications. The Eagle XP8 PEALD system can be configured with up to four Dual Chamber Modules (DCM), enabling eight chambers in high-volume production within a very compact footprint.

The system can be configured with up to four Dual Chamber Modules (DCM), enabling eight chambers in high-volume production within a very compact footprint. Processes include a broad range of dielectric PECVD films for applications such as interconnect dielectrics layers, passivation layers, and etch stop layers.