Dragon XP8 is a high-productivity 300mm tool for PECVD applications. The Dragon XP8 PECVD system can be configured with up to four Dual Chamber Modules (DCM) enabling eight chambers in high-volume production within a very compact footprint.

ASM’s key position in PECVD is on low-k films for advanced logic interconnects. Our Dragon XP8 PECVD tool addresses a broad range of dielectric films for various low-temperature deposition applications, such as interconnect, passivation, and etch-stop layers.

Eagle® XP8 is a high-productivity tool for PEALD applications which can be configured with up to four DCMs. Eagle XP8 is capable of a broad range of dielectric PEALD processes, including low-temperature spacers for multiple patterning applications.

・Dielectrics for 3D memory stack. 薄膜形成技術で多層構造の未来を築く. ASM のテクノロジーは、未来の高度なチップを作り出す半導体材料の薄膜を形成する技術である。 さらに多くの用途、さらに多くのトランジスタ、そしてさらなる複雑化によって、ますます多層化が進んでいる。 各層を組み合わせることで、新しい可能性の世界を開いていく。 お問い合わせいただくにはログインいただき、プロフィール情報を入力していただく必要があります。 ※お問い合わ …

ASM Eagle XP8 Manufacturer: ASM Model: Eagle XP Wafer Size: 300mm Platform: ASM XP8 CVD XP8 platform includes: AFE, FERB and BERB

Dragon XP8 is a high-productivity 300mm tool for PECVD applications. The system can be configured with up to four Dual Chamber Modules (DCM), enabling eight chambers in high-volume production within a very compact footprint.

ASM Eagle XP8 Plasma Enhanced ALD Tool Manufacturer: ASM International Model: Eagle XP8 Wafer Size: 300mm XP8 Platform

Dragon XP8 is a high-productivity 300mm tool for PECVD applications. The system can be configured with up to four Dual Chamber Modules (DCM), enabling eight chambers in high-volume production within a very compact footprint.

Dragon XP8 is a high-productivity 300mm tool for PECVD applications. The system can be configured with up to four Dual Chamber Modules (DCM), enabling eight chambers in high-volume production within a very compact footprint.

PECVD系统是一种基于 等离子体化学气相沉积 技术的薄膜沉积设备，能够对各种材料进行薄膜沉积，包括金属、半导体、绝缘体等。 PECVD技术在微电子、光电、平板显示、储能等领域具有重要的应用价值。