XP8 QCM is a 300mm tool for high-productivity plasma enhanced atomic layer deposition (PEALD) for advanced node memory and logic applications. The QCM, or Quad Chamber Module, is a process module with four tightly integrated process reactors.

Eagle XP8 is a high-productivity 300mm tool for plasma-enhanced ALD (PEALD) applications. The Eagle XP8 PEALD system can be configured with up to four Dual Chamber Modules (DCM), enabling eight chambers in high volume production within a very compact footprint. XP8 QCM is a PEALD tool focused on advanced node memory and logic applications.

Eagle XP8 is a high-productivity 300mm tool for plasma-enhanced ALD (PEALD) applications. The Eagle XP8 PEALD system can be configured with up to four Dual Chamber Modules (DCM), enabling eight chambers in high volume production within a very compact footprint.

XP8 QCM is a 300mm tool for high-productivity plasma-enhanced atomic layer deposition (PEALD) for advanced node memory and logic applications. The QCM, or Quad Chamber Module, is a process module with four tightly integrated process reactors.

2019年1月23日 · ASM International N.V. (Euronext Amsterdam: ASM) today introduced its XP8 QCM tool for high-productivity 300mm single-wafer plasma enhanced atomic layer deposition (PEALD) and plasma enhanced...

2019年1月23日 · The QCM, or Quad Chamber Module, is a process module with four tightly integrated process reactors. Up to four QCM modules can be configured to each XP8 platform, enabling processing of up to 16 wafers at a time.

2019年1月23日 · ASM International N.V. introduced its XP8 QCM tool for high-productivity 300mm single-wafer plasma enhanced atomic layer deposition (PEALD) and plasma enhanced chemical vapor deposition (PECVD) applications. The QCM, or Quad Chamber Module, is a process module with four tightly integrated process reactors.

ASM Eagle XP8 Plasma Enhanced ALD Tool • Manufacturer: ASM International • Model: Eagle XP8 • Wafer Size: 300mm • XP8 Platform • Front and rear Operations/Maintenance Touch Screen with pen • Loader module transfer robot and controller with 3 load ports. • 2 Load locks • Wafer cooling chamber

2019年1月29日 · ASM은 생산성을 높인 플라즈마원자층증착 (PEALD)·플라즈마화학기상증착 (PECVD) 장비 'XP8 QCM'을 출시한다고 밝혔다. PECVD와 PEALD 모두 박막을 실리콘 웨이퍼에 덮는 공정으로, D램 패터닝 등 다양한 반도체 공정에서 사용된다. XP8 QCM은 반도체 미세화와 고집적화로 더욱 높은 생산성을 요구받는 제조사를 겨냥한 제품이다....

2019年1月23日 · ASM International N.V. (Euronext Amsterdam: ASM) today introduced its XP8 QCM tool for high-productivity 300mm single-wafer plasma enhanced atomic layer deposition (PEALD) and plasma enhanced ...