High Bandwidth Memory (HBM) is a computer memory interface for 3D-stacked synchronous dynamic random-access memory (SDRAM) initially from Samsung, AMD and SK Hynix.

High-bandwidth memory (HBM) is a JEDEC-defined standard, dynamic random access memory (DRAM) technology that uses through-silicon vias (TSVs) to interconnect stacked DRAM die. In its first implementation, it is being integrated with a system-on-chip (SoC) logic die using 2.5D silicon interposer technology.

传统内存如独立小平房，HBM 则似高楼大厦，其叠层设计大幅提升存储密度与数据传输效率。 以数据比作汽车，传统内存的传输路径像又窄又长的公路，易拥堵，数据传输慢；HBM 的叠层设计则如宽阔高速公路，位宽增加、传输路径缩短，大大提高数据传输速度。

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2024年5月22日 · 高频宽存储器（HBM,High Bandwidth Memory），是将DRAM透过先进封装技术堆叠而成，与GPU整合于同一块芯片上，更有利于就近存取、传输资料。 主要制造方法为利用硅穿孔（TSV）技术，在芯片钻出小洞，再填充如铜这样的导电物质，连接金属球以达通电效果。 HBM技术难在哪？ “把DRAM叠起来”听来简单，但实际上存在不少技术难度。 Vaidyanathan指出3项关系着良率的技术难点： 首先，是厚度。 HBM厚度仅为人类头发的一半，意味着每一 …

2024年11月24日 · HBM，HBM (高带宽存储器)是一种基于3D堆栈工艺的高性能半导体存储器。 HBM本质上是基于2.5/3D先进封装技术，把多块DRAM堆叠起来后与GPU芯片封装在一起，实现大容量、高位宽的DDR组合阵列。

2024年5月27日 · High Bandwidth Memory (HBM) is created by stacking DRAM using advanced packaging technology and integrating it with the GPU on the same chip, facilitating closer …

HBM3 (High Bandwidth Memory 3) is an advanced memory technology that offers significant improvements over its predecessor, HBM2E. With increased storage capacity, speed, and power efficiency, HBM3 is set to revolutionize the graphics, cloud computing, networking, AI and potentially the automotive industry. Here, we outline the key benefits of HBM3:

Samsung's HBM (High Bandwidth Memory) solutions have been optimized for high-performance computing (HPC), and offer the performance needed to power next-generation technologies, such as artificial intelligence (AI), that will transform how we live, work, and connect.