2019年12月17日 · HRL Laboratories, LLC, is completing development of wafer-scale infrared focal plane arrays (FPAs) that will dramatically reduce the size and cost of infrared (IR) cameras. HRL was selected to carry on Phase III of the Defense Advanced Research Project Agency (DARPA)’s program Wafer-scale Infrared Detectors or WIRED.

2024年3月11日 · Now, HRL will undertake Phase 3 of DARPA’s program, called FOcal arrays for Curved Infrared Imagers (FOCII). In a first-of-its-kind hardware demonstration, HRL intends to build an ambitious test camera that will showcase the newly curved sensor technology and highlight key benefits such as enhanced imaging capability and reduced camera size.

2020年1月18日 · 美国HRL实验室目前正在完成晶圆级红外焦平面阵列（FPA）研制工作，这将会大大减小红外相机的尺寸和成本。 图为HRL实验室的WIRED研究团队：从左到右依次为Shuoqin Wang、Sevag Terterian、Brett Nosho、Minh Nguyen以及Alex Gurga （来源：HRL实验室）

2020年6月1日 · HRL Laboratories, LLC, scientists and engineers are taking on the challenge of developing sensors that are doubly-curved, like a bowl, under a new program from the Defense Advanced Research Project Agency (DARPA) sighted on the advancement of infrared (IR) vision.

2023年1月1日 · We have demonstrated dual-band infrared focal plane arrays (FPA) using type II InAs/GaSb superlattice photodetector with simultaneous detection in both the mid- and the long-wavelength (MW/LW) atmospheric windows of 3–5 μm and of 8–12 μm.

2017年5月16日 · InAs/GaSb Type II superlattices (T2SLs) are a promising III-V alternative to HgCdTe (MCT) for infrared Focal Plane Array (FPA) detectors. Over the past few years SCD has developed the modeling,… The recent introduction of a M-structure design improved both the dark current and R0 A performances of type-II InAs-GaSb photodiodes.

红外传感器的性能不仅对机械应变（ 弯曲) 敏感， 而 且 还 会 受 到 制 冷 过 程 的 影 响 。 因此 ， HRL 实验室将通过研究弯曲加工工艺如何改变传感 器的性能来确定怎样才能最好地猶用这项技术. 晶圆级红外探测器制备工艺 目前， 微里数码相机已经变得像智能手机一 样普及.这些高分辨率可见光栢机具有制造快 速 、成 本 低 廉 等 优 点 ，然而 微 型 红 _ 外相抵和传感 器制作起来则既费时又學贵。 在美菌菌防高级研究计.

2019年4月18日 · Raytheon Vision Systems (RVS) has developed and demonstrated the first-ever 1280 x 720 pixel dual-band MW/LWIR focal plane arrays (FPA) to support 3rd-Generation tactical IR systems under the U.S. Army’s Dual-Band FPA Manufacturing (DBFM) program.

Raytheon Vision Systems (RVS) has developed and demonstrated the first-ever 1280 x 720 pixel dual-band MW/LWIR focal plane arrays (FPA) to support 3rd-Generation tactical IR systems under the U.S. Army's Dual-Band FPA Manufacturing (DBFM) program.

2016年8月9日 · The Defense Advanced Research Projects Agency (DARPA) has awarded HRL Laboratories, LLC, funding to research novel ways to synthesize semiconductors for sensing in the infrared spectrum, and methodologies to cost effectively integrate the infrared materials with silicon read-out integrated circuits (ROIC).