The Texas Instruments (TI) 56-pin QFN package, designated RGQ, is a JEDEC standard MO-220-compliant leadless package that has several advantages over traditional SOIC, TQFP, TSSOP, and TVSOP packaging.

QFN封装不同于具有欧翼状引脚的传统DIP或SOP封装，QFN封装经过表面贴装后管脚与PCB焊盘之间的导电路径短，自感系数和封装体内的布线电阻很低，所以它也可以提供良好的电性能。 QFN封装使用的载体多为平面设计金属框架，采用精准可控的蚀刻方式生产制造，因此具有框架表面处理方式多样化、结构设计多样化的特点，且搭配属性相吻合的塑封材料，可以改进、增强封装体内部各界层的结合力，阻止外部湿气进入产品内部造成芯片失效，增强产品可靠性；且QFN …

Texas Instruments (TI) Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold several advantages over traditional SOIC, SSOP, TSSOP, and TVSOP packages.

Find the Quad Flat No Lead (QFN) package drawing and specifications such as pin count, pitch and dimension.

QFN is a lead frame-based package which is also called CSP (Chip Scale Package) with the ability to view and contact leads after assembly. QFN packages typically use a copper lead frame for the die assembly and PCB interconnection. The QFN package can …

QFN（Quad Flat No-leads Package，方形扁平无引脚封装），表面贴装型封装之一。 值得注意的是，QFN封装与LCC封装完全不同，LCC仍有外延引脚，只是将引脚弯折至底部，而QFN封装则完全没有任何外延引脚。

2012年12月13日 · QFN是一种无引脚封装，呈正方形或矩形，封装底部中央位置有一个大面积裸露焊盘用来导热，围绕大焊盘的封装四周有实现电气连接的导电焊盘。 由于 QFN封装不像传统的SOIC与TSOP封装那样具有鸥翼状引线，内部引脚与焊盘之间的导电路径短，自感系数以及封装体内布线电阻很低，所以它能提供卓越的电性能。 此外，它还通过外露的引线框架焊盘提供了出色的散热性能，该焊盘具有直接散热通道，用于释放封装内的热量。 通常将散热焊盘直接焊接在 …

QFN封装. QFN（ Quad Flat No-lead ）封装是一种四面平无引脚的封装方式，集成电路被封装在塑料芯片内，四面开有电子连接端，其主要特点是没有引脚。 特点： - 小尺寸，低高度，适用于高密度的电路板设计。

2015年7月14日 · QFN and DFN packages are plastic encapsulated lead-frame-based packages, which are near Chip Scale Package (CSP) with a low profile (<1.0 mm). This pack-age type uses perimeter lands/pins on the bottom of the package to provide electrical contacts to the PCB. Perimeter pins can be arranged in dual-in-line (DFN) or quad (QFN) configuration.

Quad Flat No-Lead (QFN) and Dual Flat No-Lead (DFN) package offering includes QFNs, QFNp, VQFN, WQFN, UQFN, XQFN, QFNp-dr and QFNs-mr. We offer multiple QFN configurations in either punch or saw singulated formats. Punch singulated packages are individually “punched” from molded strips during final assembly; saw singulated