2018年8月4日 · 那么结论就出来啦：QFP，LQFP，TQFP都是方形扁平封装，在厚度上（QFP>LQFP>TQFP），LQFP和TQFP的PCB封装是可以通用的，前提是bodysize或引脚间距相同。 而QFP就不能和这两种通用了。 LQFP和TQFP都属于QFP封装，但是，大部分器件的datasheet上应该都明确指出了他的封装是LQFP还是TQFP，而如果只是说是QFP封装，那么看一下它的L1尺寸就知道他具体是哪种了，因为LQFP和TQFP的L1都是1.0mm，而QFP却有好多 …

A thin quad flat pack (TQFP) provides the same benefits as the metric QFP, but is thinner. Regular QFP are 2.0 to 3.8 mm thick depending on size. TQFP packages range from 32 pins with a 0.8 mm lead pitch, in a package 5 mm by 5 mm by 1 mm thick, to 256 pins, 28 mm square, 1.4 mm thick and a lead pitch of 0.4 mm. [2]

The purpose of this document is to provide PCB design reference information and surface mount guidelines relating to the novel integration of inner leads in TQFP packages used for Microsemi products, including VSC7420/VSC7421/VSC7422 SparX-III Ethernet switches and VSC8522 12-port 10/100 /1000BASE-T PHY.

Amkor offers a broad line of TQFP (Thin Quad Flat Pack) IC packages. Amkor’s TQFPs are an ideal package for most IC semiconductor technologies such as ASIC, gate arrays (FPGA/PLD), microcontrollers and PMIC controllers.

The Thin Quad Flat Pack, or TQFP, is a surface-mount IC package with gull wing leads on all four sides of the package body. It is basically a thinner version of the MQFP and LQFP. The TQFP comes in different body sizes that range from 5 mm square to 20 mm square. TQFP lead counts, on the other hand, range from 32 to 176.

TQFP (thin quad flat package,即薄塑封四角扁平封装)薄四方扁平封装低成本，低高度引线框封装方案。 薄四方扁平封装对中等性能、低引线数量要求的应用场合而言是最有效利用成本的封装方案，且可以得到一个轻质量的不引人注意的封装,TQFP系列支持宽泛范围的印模尺寸和引线数量，尺寸范围从7mm到28mm，引线数量从32到256。 产品 体尺寸 (mm) 引线间距 (mm) TQFP 100 14 0.50。 TQFP 120 14 0.40. TQFP 128 14*20 0.50. TQFP 144 20 0.50. TQFP 176 24 0.50. …

Amkor ofers a broad line of TQFP (Thin Quad Flat Pack) IC packages. These packages allow IC packaging engineers, component specifiers and systems designers to solve issues such as increasing board density, die shrink programs, thin end‐product profile and portability.

The thin quad flat package is the most cost-effective packaging solution for applications with medium performance and low lead count requirements, and a light-weight, unobtrusive package can be obtained. The TQFP series supports a wide range of die sizes and The number of leads ranges from 7mm to 28mm, and the number of leads ranges from 32 to 256.

Amkor offers a broad line of TQFP (Thin Quad Flat Pack) IC packages. These packages allow IC packaging engineers, component specifiers and systems designers to solve issues such as increasing board density, die shrink programs, thin end‑product profile and portability.

2025年1月19日 · 本文介绍了qfp系列封装技术，包括qfp、lqfp和tqfp，详细阐述了它们的特点和规格。 此外，还提及了新型的TEQFP封装以及母线技术的应用，使得QFP封装也能支持高密度连接。