8-pin DFN package with reduced exposed pad size recommended for new designs from EverSpin.

2021年10月26日 · DFN/QFN平台是最新的表面贴装封装技术。 印刷电路板（PCB）的安装垫、阻焊层和模版样式设计以及组装过程，都需要遵循相应的原则。 DFN/QFN封装概述 DFN/QFN平台具有多功能性，可以让一个或多个半导体器件在无铅封装内连接。 下图就展示出了这一封装的灵活性 …

Underside of a Single−Chip 8 Pin DFN Package. Figure 3 illustrates how the package height is reduced to a minimum by having both the die and wirebond pads on the same plane. When mounted, the leads are directly attached to the board without a space−consuming standoff, which is inherent in a leaded package.

The IXD_604 family is available in a standard 8-pin DIP (PI), 8-pin SOIC (SIA), 8-pin Power SOIC with an exposed metal back (SI), and an 8-pin DFN (D2) package.

ALL DIMENSIONS ARE IN MILLIMETERS DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE EXPOSED PAD SHALL BE SOLDER PLATED SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON TOP AND BOTTOM OF PACKAGE

2023年5月5日 · 面对应用端的迫切需求，广东场效应半导体在半导体芯片设计和封装工艺勇于创新，加大研发投入，精准研发新产品，目前着力于研发DFN-8封装超薄、超小体积封装形式的MOSFETs。

Dimensioning and tolerancing conform to ASME Y14.5m-1994. Dimension applies to the metallized terminal and is measured between 0.25mm and 0.30mm from the terminal tip. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends).

Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. On this page you can find the …

STC8G1K08-36I-DFN8 SMT扩展库 PCB免费打样 品牌名称 STC 商品型号 STC8G1K08-36I-DFN8 商品编号 C915662 商品封装 DFN-8-EP (3x3) 包装方式 托盘 商品毛重 0.745克 (g) 数据手册

时代速信的GSL805AD是一种低噪声放大器（LNA），采用8 PIN 2X2毫米DFN封装，能在0.5GHz至5GHz的频率范围内工作。 支持片上输入/输出匹配电路，采用砷化镓pHEMT工艺制造。