2021年1月27日 · 在引脚数量不超过 40 的领域， SOP 是普及最广的表面贴装封装，典型引脚中心距 1.27mm (50mil) ，其它有 0.65mm 、 0.5mm ；引脚数多为 8～ 32；装配高度不到 1.27mm 的 SOP 也称为 TSOP 。 表 1、常用缩写代码含义. 小外形封装。 在 EIAJ 标准中，针脚间距为 1.27mm (50mil) 的此类封装被称为 “SOP”。 请注意， JEDEC 标准中所称的 “SOP”具有不同的宽度。 小外形集成电路。 有时也称为 “SO”或“SOL”，在 JEDEC 标准中，针脚间距为 1.27mm …

1.3.4.1. 8-pin SOIC Device Pin Information 1.3.4.2. 16-pin SOIC Device Pin Information

The SparkFun 8-Pin SOIC to DIP Adapter is a small PCB that lets you adapt SOIC packages into a DIP footprint. These are useful for modding and upgrading devices that use 8-pin DIP ICs, when the upgraded IC is only available in a SOIC footprint. You can also use it for prototyping, to make SOIC packages compatible with solderless breadboards.

2017年8月17日 · The SparkFun 8-Pin SOIC to DIP Adapter is a small PCB that lets you adapt SOIC packages into a DIP footprint. These tiny boards are useful for modding and upgrading devices that use 8-pin DIP ICs, when the upgraded IC is only available in a SOIC footprint.

The 8-pin SOIC SPI interface consists of the four SPI signals, a Reset signal and GPIO_3.

The SparkFun 8-Pin SOIC to DIP Adapter is a small PCB that lets you adapt SOIC packages into a DIP footprint. These tiny boards are useful for modding and upgrading devices that use 8-pin DIP ICs, when the upgraded IC is only available in a SOIC footprint

View 8-Pin SOIC to DIP Adapter Hookup Guide by SparkFun Electronics datasheet for technical specifications, dimensions and more at DigiKey.

These devices consist of two gallium arsenide infrared emitting diodes optically coupled to two monolithic silicon phototransistor detectors, in a surface mountable, small outline, plastic package. They are ideally suited for high−density applications, and eliminate the need for through−the−board mounting. Figure 1. Schematic.

This is a blank PCB that allows the operation of Microchip Technology’s 8-pin devices to be easily evaluated. Each device pin is connected to a pull-up resistor, a pull-down resistor, an in-line …

2005年3月1日 · The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board is a blank PCB that allows the user to configure the circuit to the exact requirements. The passive components use the surface-mount 805 package layout.