Our Ultra FnA ALD system delivers everything you look for in high-throughput batch ALD processing. It deposits both silicon nitride (SiN) and silicon carbide nitride (SiCN) with good step coverage and uniformity within wafer and wafer-to-wafer and is easily customized with minor component and layout changes.

2018年1月1日 · Atomic layer deposition (ALD) is ideal for applying precise and conformal coatings over nanoporous materials. We have recently used ALD to coat two nanoporous solids: anodic aluminum oxide (AAO) and silica aerogels. AAO possesses hexagonally ordered ...

In this thesis, a new method for ALD nanoparticle synthesis was developed that can be used to prepare catalysts. Using oxygen gas as the co-reactant, area-selective ALD of metal oxides by metalorganic precursors that typically reactive strong oxidants to proceed was achieved selectively on noble metal surfaces by exploiting the catalytic ...

Part of ACM’s Ultra family of advanced wafer processing systems, the Ultra Furnace platform addresses dry processing challenges of low-pressure chemical vapor deposition (LPCVD), atomic layer deposition (ALD), oxidation and annealing. The Ultra Furnace was designed from the ground up to meet best-in-class requirements.

2024年12月10日 · ACM’s Ultra Fn A Thermal ALD Tool has been qualified for the deposition of silicon carbon nitride (SiCN) films. It enables ultra-thin, void-free film deposition with precise control...

Atomic layer deposition (ALD) is ideal for applying precise and conformal coatings over nanoporous materials. We have recently used ALD to coat two nanoporous solids: anodic aluminum oxide (AAO) and silica aerogels. AAO possesses hexagonally ordered ...

Explore advanced semiconductor process systems across Wet Processing, ECP, Thermal Deposition Processes, Track Systems, PECVD and Polishing.

2024年8月11日 · The Ultra FnA Furnace System by ACM Research is designed for the precise and uniform deposition of ultra-thin films using thermal Atomic Layer Deposition (ALD), which is essential for advanced integrated circuits (ICs) and compound semiconductor manufacturing as logic nodes shrink.

2022年9月27日 · The Ultra Fn A system adds thermal atomic layer deposition (ALD) to ACM’s extensive list of supported furnace applications. The company also announced that it has shipped the first Ultra...

ACM has opened more than 117,500 articles published between 1951 and the end of 2000, during the first 50 years of its publishing program. These articles, which include many foundational articles by the pioneers of the field, are now freely available to view and download via …