2013年1月1日 · First principle calculations based on density functional theory (DFT) are used to calculate the structural, elastic and electronic properties of tin–silver intermetallic compound (Ag 3 Sn), found mainly in lead free solder joints. In present work, for the exchange-correlation energy, generalized gradient approximation (GGA) functional is used.

2023年5月1日 · Soldering to copper substrates significantly catalysed Ag3Sn nucleation. This is shown to be due to constitutional supercooling generated by Ag solute rejection into the liquid ahead of the Cu6 Sn 5 reaction layer, with additional contributions from geometrical catalysis in the grooves between Cu 6 Sn 5 scallops and heterogeneous nucleation of ...

2023年5月13日 · 通过分析吸热峰可以了解Ag3Sn的液相线温度。 Ag3Sn过冷 下图描述了过冷对Sn95Ag5中初级Ag3Sn生长的作用，回流冷却速率为5K/min。 从结果来看，Ag3Sn成核过冷范围大约为17–68°C。 此外，Ag3Sn在最小的过冷度（<20°C）下的生长形状为单晶板。

2017年12月12日 · 化合物Ag3Sn采用有序斜方晶D0a Cu3Ti型结构。 对于金属间化合物，它表现出不寻常的低屈服应力和高延展性，但这些影响的原因尚不清楚。 在这里，我们报告了关于溶液生长的 Ag3Sn 单晶中存在的缺陷的电子显微镜研究，这些缺陷在倾析和后续处理过程中变形。

2023年1月27日 · Eutectic Ag 3 Sn can grow with a variety of morphologies depending on the solidification conditions and plays an important role in the performance of Pb-free solders. Here, we study morphology transitions in the β -Sn + Ag 3 Sn eutectic at increasing growth velocity using a combination of real-time X-ray imaging and analytical electron microscopy.

2024年4月3日 · Using EBSD techniques, accommodated for a pseudo-hexagonal setting of Ag 3 Sn to avoid pseudo-symmetry, and subsequent lattice transformation to an orthorhombic structure (a = 5.97 Å, b = 4.78 Å, c = 5.18 Å, Pmmn), this study reveals predominant (001) orth facets in Sn-10Bi-1Ag, and both (001) orth and more frequent (010) orth facets in Sn-57Bi-...

2015年8月8日 · In this paper, a new explicit state variable was introduced which describes the Ag 3 Sn intermetallic morphology inside of lead-free solder joints at different cooling rates.

2008年9月1日 · 多面体 Ag3Sn IMCs 相生长的驱动力与达到的过冷度成正比，符合经典凝固理论的预测。 结果解释了在缓慢冷却的共晶 Sn-Ag 焊料中大块 Ag3Sn IMC 的形成和快速生长，在凝固过程中过冷度最低。

1 天前 · Ag3Sn plays a connecting role in the bonding between a Sn-based solder and an Ag substrate due to its excellent connectivity performance. Therefore, it is parti

The article presents synthesis, characterization and optical properties of nanoparticles from the intermetallic Ag3Sn compound and the potential possibilities for their use to enhance the luminescence of organic compounds.