Co-Packaged Optics (CPO) is an advanced heterogeneous integration of optics and silicon on a single packaged substrate aimed at addressing next generation bandwidth and power challenges. CPO brings together a wide range of expertise in fiber optics, digital signal processing (DSP), switch ASICs, and state-of-the-art packaging & test to provide ...

CPO platform drives optics directly from Switch and reduces cost and power per bit. Broadcom’s CPO Timeline... Broadcom’s Disruptive Silicon + Photonics Platform ...

Co-Packaged Optics (CPO) is an advanced heterogeneous integration of optics and silicon on a single packaged substrate aimed at addressing next generation bandwidth and power challenges. CPO brings together a wide range of expertise in fiber optics, digital signal processing (DSP), switch ASICs, and state-of-the-art packaging & test to provide ...

2024年3月14日 · Broadcom’s CPO and silicon photonics technology platform, with its high degree of integration, provides the lowest latency, highest bandwidth density, lowest power, and lowest cost solution to meet this need and can help build large-scale, power-efficient AI clusters.

Broadcom has invested in co-packaged optics to scale the optical interconnect into the age of AI. I will focus on two areas of scale in this post: integration and manufacturing. Integration is at the heart of CPO, and has to be done right. The first image below visually summarizes our approach to high density photonic integration for CPO.

2023年11月3日 · 前面根据ECTC 2023的会议文章，介绍了Broadcom的CPO技术(Broadcom的CPO进展)。 但文中的CPO产品并不是Broadcom最新一代CPO，最近凑巧在Linkin上划水时看到了一张图片，涉及到了博通最新一代51.2T CPO产品的一些技术细节，这里和大家分享一下。

2023年10月18日 · Broadcom给出了该CPO系统的四个特色，即高密度的光学连接器(high density optical connector)、高密度的3D集成(high density integration)、pitch匹配的输入输出接口和高密度的光器件(high density optical component)。

2024年3月21日 · 博通宣布已向客户交付了业界首款51.2Tbps共封装光学(CPO)以太网交换机--Bailly。 该产品将八个基于硅光子的6.4-Tbps光学引擎与博通同类最佳的StrataXGS Tomahawk5交换芯片集成在一起。

2023年3月1日 · Broadcom Tomahawk 5 Bailly 51.2T Co Packaged Optics CPO Switch. This new chip is able to power 800Gbps of traffic at 5.5W by reducing the need to electrically drive signals to pluggable optics at the front of the switch. For some frame of reference, the Tomahawk 4 Humboldt 25.6T co-packaged optics platform was ~6.4W for a 800Gbps link.

Our Tomahawk® 5-based 51.2T Bailly CPO marks our introduction of an all CMOS EIC, including a very low power TIA, as well as a monolithically integrated optical MUX/DEMUX on the PIC. We have increased optical engine bandwidth from 3.2T on Humboldt to 6.4T on Bailly so that we can deliver an all-optical 51.2 CPO switch solution.