Back end of line - Wikipedia
Back end of the line or back end of line (BEOL) is a process in semiconductor device fabrication that consists of depositing metal interconnect layers onto a wafer already patterned with …
关于FEOL、BEOL和MOL的创新方案及通往1nm技术节点的可能途 …
BEOL是加工的最后阶段，指的是位于芯片顶部的互连。 互连是复杂的布线方案，它分配时钟和其他信号，提供电源和地，并将电信号从一个晶体管传输到另一个晶体管。
An Investigation on the Most Likely Failure Locations in the BEoL Stack ...
2023年10月19日 · A representative volume element of the detailed complex BEoL structure is analyzed to obtain the equivalent mechanical properties of the BEoL stack. The result is then …
Foundry Monolithic 3D BEOL Transistor + Memory Stack: Iso …
2023年7月24日 · We show, for the first time, a BEOL carbon nanotube FET (CNFET) + Resistive RAM (RRAM) stack through monolithic 3D (M3D) integration, directly over silicon (Si)
Crack identification and evaluation in BEoL stacks of two different ...
2021年6月1日 · In this paper, the behavior of BEoL stacks under mechanical load is studied and a methodology is proposed to obtain a deeper insight into the cracking process.
Impact of back-end-of-line architecture on chip-package-interaction …
2020年9月1日 · In this study, the impact of the BEOL architecture in terms of via density and metal density on the failure location and the amount of observed BEOL failures is …
BEoL stack robustness investigations utilizing Cu-pillar …
2022年9月1日 · In this work, the development and deployment of two different testing methods to evaluate mechanical BEoL (Back end of Line) stack robustness by inducing micromechanical …
Mechanical reliability assessment of 28nm Back End of Line (BEoL) stack ...
In order to address the Chip-Package Interaction (CPI) challenges at an early stage of the product development, GLOBALFOUNDRIES has developed Finite Element (FE) models to simulate …
BEOL stack-aware routability prediction from placement using …
In advanced technology nodes, physical design engineers must estimate whether a standard-cell placement is routable (before invoking the router) in order to maintain acceptable design …
基于紧凑的三维有限元模型对大型I/O芯片28nm后端线 (BEOL)堆栈 …
2013年12月1日 · 由于在硅后端 (BEOL)中使用的超低k材料，芯片封装相互作用 (CPI)是一个广泛认可的倒装芯片封装的质量和可靠性挑战。 本文讨论了为解决这一挑战而开发的预测有限元 …
- 某些结果已被删除