Notes (1) Die Attach Cavity Option: Bare Ceramic Surface or Gold Paste (2) Leadframe Surface Finish Option: Aluminum Thin Film Deposition on Wire Bond Area or Electrolytic Gold Plating on All the Surface of Leadframes

Cerquad packages are constructed of a single pressed layer of 92% Alumina (Al 2 0 3), with a leadframe embedded into a non-vitreous glass. The lead configurations are either flat leaded, J-bend, or gullwing. These packages do not have a metallized seal ring and they use a ceramic cap.

6、Cerquad 封装 表面贴装型封装之一，即用下密封的陶瓷 QFP，用于封装 DSP 等的逻辑LSI 电路。 带有窗 口的 Cerquad用 于封装EPROM 电路。

Ceramic Quad Flat Packages (Cerquad) are a family of ceramic packages manufactured by the dry pressing method. Two dry pressed rectangular or square shaped pieces of ceramic (cap and base) are silk screen printed with solder glass and then glazed.

表面贴装型封装之一，即用下密封的陶瓷QFP，用于封装DSP 等的逻辑LSI 电路。带有窗口的Cerquad 用于封装EPROM 电路。散热性比塑料QFP 好，在自然空冷条件下可容许1.5～2W 的功率。

The CERamic QUADpack, better known as a Cerquad is a square, ceramic, surface mount package. It is constructed of a single pressed layer of 92% Alumina ((Al 2 0 3), with a leadframe embedded into the non-vitreous glass. These packages can be hermetic or non-hermetic.

Notes (1) Die Attach Cavity Option: Bare Ceramic Surface or Gold Paste (2) Leadframe Surface Finish Option: Aluminum Thin Film Deposition on Wire Bond Area or Electrolytic Gold Plating on All the Surface of Leadframes

四面引脚扁平封装(cerquad) 这种封装是一种密封的表面安装封装形式。 陶瓷，引脚框架和陶瓷三者用玻璃密封连在一起，形成内部芯片的连接和外部与电路板的连接。

2023年10月8日 · Cerquad是指表面贴装型封装之一，即用下密封的陶瓷QFP，用于封装DSP等的逻辑LSI电路。 带有窗口的Cerquad用于封装EPROM电路。 散热性比塑料QFP好，在自然空冷条件下可容许1.5～2W的功率。

Cerquad 封装由 92% 氧化铝 (Al 2 0 3 )的单一压制层构成，引线框架嵌入非玻璃质玻璃中。 引线配置为扁平引线、J 型弯曲或鸥翼型。 这些封装没有金属化密封环，它们使用陶瓷盖。