8 Pin Clamshell, closed top, 8 pin DFN test socket. Closed top test socket Compatible DFN Square Package Drawing; 4 Pins on opposite sides 0.65mm (25.6 mil) pitch 3.0 x 3.0mm Square Body width Mfr. Loranger Status - In Stock; Drawing request

N/A 8 Input/Output (I/O) and 0.08 Millimeter (mm) Pitch Dual Flat No (DFN) Lead Socket : Package Name N/A DFN : Number of Input/Output (I/O) N/A 8 : Pitch N/A 0.08 mm 0.031 in: QUOTE 03749 091 6218A /Asset/Socket_QFN.jpg: N/A 8 Input/Output (I/O) and 0.041 Millimeter (mm) Pitch Dual Flat No (DFN) Lead Socket : Package Name N/A DFN : Number of ...

Specifically designed to deliver kelvin test solutions for your DFN and QFN devices, our leadless test sockets offer unrivaled versatility. The interchangeable socket design allows each component to be replaced individually, providing the ability to test a multitude of devices with one socket.

2015年7月14日 · QFN and DFN packages are plastic encapsulated lead-frame-based packages, which are near Chip Scale Package (CSP) with a low profile (< 1.0 mm). This pack-age type uses perimeter lands/pins on the bottom of the package to provide electrical contacts to the PCB. Perimeter pins can be arranged in dual-in-line (DFN) or quad (QFN) configuration.

2023年8月23日 · DFN (Dual Flat No-lead) 测试座是一种用于测试DFN封装的集成电路(IC)的设备。DFN封装是一种无引脚的表面安装封装，其外部电气连接是通过焊盘(pads)实现的，这些焊盘位于封装的底部并且沿着两边对齐。

深圳谷易电子生产的DFN8pin测试座socket—dfn芯片测试夹具的产品简介、性能、特点、规格、应用、生产厂家介绍 适用于DFN8pin芯片测试环境：老化、测试、烧录，芯片可靠性测试、芯片性能测试、芯片功能测试

DFN/QFN or QFP target adapters and Surface Mount QFP sockets designed to be soldered into the user's target system in place of a respective DFN, QFN or QFP component. Used in conjunction with other DFN, QFN or QFP support tools …

Universal DFN Programming Adapters and IC Sockets. To meet the needs to the DFN programmer adapter in programmer adapters markets, we offer a wide range of DFN Package Programming Adapter, including: DFN10 to DIP10 10 pin ic socket, DFN8 chip adapter.

2023年8月23日 · DFN (Dual Flat No-lead) 测试座是一种用于测试DFN封装的集成电路(IC)的设备。DFN封装是一种无引脚的表面安装封装，其外部电气连接是通过焊盘(pads)实现的，这些焊盘位于封装的底部并且沿着两边对齐。

Various onsemi components are packaged in an advanced Dual or Quad Flat−Pack No−Lead package (DFN/QFN). The DFN/QFN platform represents the latest in surface mount packaging technology. It is important to follow the suggested board mounting guidelines outlined in …