
T2070064201-000 : HDC Connector Hardware | TE Connectivity
Get T2070064201-000 HDC Connector Hardware specs, pricing, inventory availability, and more from TE Connectivity. Get a sample or request a quote.
H6bn | Sigma-Aldrich
h6bn. Applied Filters: Keyword:'h6bn' Showing 1-1 of 1 result for "h6bn" within Products. Products Building Blocks Explorer Genes Papers Technical Documents Site Content Chromatograms. Filter & Sort. All Photos (6) Borane-ammonia complex. Synonym(s): Amminetrihydroboron, Borazane. Linear Formula: H 3 N · BH 3. CAS No.: 13774-81-7.
Borane ammonia complex | H6BN - ChemSpider
ChemSpider record containing structure, synonyms, properties, vendors and database links for Borane ammonia complex, Ammonia borane, WZMUUWMLOCZETI-UHFFFAOYSA-N
T2070064201-000 : HDC 连接器硬件 | TE Connectivity
获取 T2070064201-000 HDC 连接器硬件 TE Connectivity 的规范、定价、库存可用性等信息。 获取样品或请求报价。
Ammonia borane | H6BN - ChemSpider
ChemSpider record containing structure, synonyms, properties, vendors and database links for Ammonia borane, 13774-81-7, Boron, amminetrihydro-, PJYXJGDRFASJSB-UHFFFAOYSA-N
Borane ammonia complex | 13774-81-7 - ChemicalBook
Borane ammonia complex is a proposed storage medium for hydrogen in motor fuel vehicles, also used in organic synthesis. This product has been enhanced for energy efficiency. reagent type: reductant.
TE’s modular HDC series has been expanded to include a range of connectors with dynamic inserts. Designed specifically for harsh environments for industrial applications, the new HDC Dynamic series makes it possible to reduce cable assembly costs by using semi-automatic or fully-automatic crimping of dynamic contacts.
H6bn | Sigma-Aldrich
Find h6bn and related products for scientific research at MilliporeSigma
T2070064201-000 TE Connectivity | Mouser - 贸泽
TE Connectivity HDC Dynamic模块集成了Dynamic系列灵活信号和电源解决方案以及HDC重载连接器系列,提供了一套恶劣环境连接器解决方案。 TE HDC Dynamic模块具有这两个系列的出 …
六方氮化硼的介电常数、电导率和击穿场,Materials Research …
2022年6月3日 · 鉴于六方氮化硼 (hBN) 在二维材料电子学中的广泛使用,在低场介电常数和高场强以及高达击穿电压的电导率方面改进其介电特性变得很重要。 本研究旨在通过在 10-100 nm 范围内可变厚度的两个 Au-hBN-Au 电容器系列中使用 DC 和 RF 传输来填补这一空白,这些电容器由大型高压高温 (HPHT) 晶体和聚合物制成衍生陶瓷 (PDC) 晶体。 我们推导出平面外低场介电常数 ε ∥ = 3.4 ± 0.2 与 Ohba 的理论预测一致 等人, 缩小了普遍接受的窗口 ε ∥ = 3–4。 发现高场直流 …