2025年3月24日 · It also projects that compared to 2024, the unit sales of HBM are forecast to increase 15-fold by 2035. Figure 2 The booming AI and HPC hardware is forecast to increase HBM sales 15-fold by 2035. Source: IDTechEx. HBM was a prominent technology highlight in 2024 for its ability to overcome the memory wall for AI processors.

2024年5月21日 · 本文介绍了DRAM内存芯片的主要分类和原理，梳理了DRAM产品尤其是HBM的迭代过程和发展趋势，分析了产业链和市场情况。 上一篇文章《AI内存瓶颈（上）：3D NAND路线图》中我们对数据存储进行了梳理，并重点介绍了ROM中的3D NAND技术原理与市场情况。 存储芯片市场中，基于闪存Flash技术的NAND是主要外部存储器，而DRAM是主要的内部存储器，二者共同占据整个半导体存储市场超过97%的份额，也在各自的领域扮演着相当重要的角色。 …

2024年5月24日 · High bandwidth memory (HBM) chips have become a game changer in artificial intelligence (AI) applications by efficiently handling complex algorithms with high memory requirements. They became a major building block in AI applications by addressing a critical bottleneck: memory bandwidth.

HBM 全称 High Bandwidth Memory，即高带宽内存，是一种新兴的DRAM 解决方案。 HBM具有基于 TSV （硅通孔）和 芯片堆叠技术 的堆叠 DRAM 架构，简而言之就是将内存芯片堆叠到一个矩阵里，再将其堆栈置于 CPU 或 GPU 的旁边，通过uBump 和 Interposer （中介层， 起互联功能的硅片）实现超快速连接。 Interposer 再通过 Bump 和 Substrate（封装基板） 连通到 BALL，最后 BGA BALL 再连接到 PCB 上。 随着深度学习等 AI 算法的发展， AI 服务器对计算能力和内存 …

2022年2月20日 · The massive growth and diversity in artificial intelligence (AI) means HBM is less than niche. It’s even become less expensive, but it’s still a premium memory and requires expertise to implement.

This paper aims to elucidate why HBM plays a pivotal role in the AI industry and discusses the imminent challenges that need to be overcome in the development of HBM memory. By exploring the significance of HBM in the context of AI applications and outlining the pressing challenges ahead, this paper contributes to understanding the importance ...

2022年1月20日 · As a memory interface for 3D-stacked DRAM, HBM achieves higher bandwidth while using less power in a form factor that’s significantly smaller than DDR4 or GDDR5 by stacking as many as eight DRAM dies with an optional base die …

2025年2月12日 · HBM是一种基于3D堆栈工艺的高性能半导体存储器， 最大的特点是高宽带，其接口远高于传统GDDR， 通过极宽的接口方式实现了更高的带宽，2023年HBM产业规模43.5亿美元，2024年大幅增长至183亿美元，同比涨幅超过300%，2025年预计涨幅仍然超过100%， 主要是随着AI的快速发展，HBM的用量大幅提升。 HBM制造主要包括TSV（硅通孔）、micro bumping（微凸点制作）和堆叠键合. AI发展对数据的处理速度、存储容量、能源效率都提出 …

2023年11月9日 · Among the array of memory technologies available, High Bandwidth Memory (HBM) has emerged as the memory of choice for AI training hardware, with the most recent generation, HBM3, delivering unrivaled memory bandwidth. Let’s take a closer look at this important memory technology.

2022年1月24日 · AI has been a big driver of HBM in GPUs, said Jim Handy, principal analyst with Objective Analysis. “GPUs and AI accelerators have an unbelievable hunger for bandwidth, and HBM gets them where they want to go.”