2021年9月9日 · Atsugi, Japan — Sony Semiconductor Solutions Corporation (“Sony”) today announced the upcoming release of two types of stacked event-based vision sensors. These sensors designed for industrial equipment are capable of detecting only subject changes, and achieve the industry’s smallest *1 pixel size of 4.86μm.

Sony Semiconductor Solutions and Prophesee collaborated to produce SONY IMX636 (HD), a stacked event based vision sensor developed around 4.86um contrast detection pixels. This Event-based vision sensors feature high-speed/low-latency response, wide dynamic range operation, focal-plane data compression and low power consumption.

2021年10月13日 · Event-based vision sensors asynchronously detect luminance changes for each pixel and output the changed data only, combining it with information on pixel position (xy coordinates) and time, thereby enabling high-speed, low latency data output.

ORDER INFORMATION IMX636-AAMR-C MUST BE ORDERED DIRECTLY FROM SONY OR SONY’S CHANNEL PARTNERS The IMX636-AAMR-C is a diagonal 7.1 mm (Type 1/2.5) approx. 0.92M effective pixels 1280 (H) x 720 (V) event-

IMX636 - CMOS Image Sensor from Sony Semiconductor Solutions Corporation. Get product specifications, Download the Datasheet, Request a Quote and get pricing for IMX636 on GoPhotonics.

近日， 索尼半导体 发布两款堆叠式事件监测视觉传感器（EVS, Event-based Vision Sensor）——IMX636、IMX637,分别为100万和30万分辨率。 该两款芯片采用了Cu-Cu连接的3D堆叠工艺，从而使事件驱动相机的像素尺寸从15um减少到4.86um，这是该领域的巨大进展。 据介绍，两款芯片主要用于工业相关领域。 索尼发布堆叠式事件监测视觉传感器，意味着巨头正式进入仿生视觉事件相机领域，相关产品及应用预计将加速落地。 索尼发布的EVS芯片仅输出事 …

The IMX636-AAMR-C is a diagonal 7.1 mm (Type 1/2.5) approx. 0.92 M effective pixels (1280 (H) × 720 (V)) event-based vision sensor.

Sony Semiconductor Solutions Corporation’s original miniaturization technology based on the structure of stacked CMOS image sensor together with Cu-Cu connection makes it possible to realize the industry’s smallest pixel with a large fill factor.

ORDER INFORMATION The IMX636-AAMR-C is a diagonal 7.1 mm (Type 1/2.5) approx. 0.92M effective pixels 1280 (H) x 720 (V) event-based vision sensor.

2021年9月9日 · 这两款新的传感器采用堆栈式技术，利用索尼专有的Cu-Cu连接技术 *2，实现了业界最小 *1 的 4.86μm像素尺寸。 除了以低功耗运行并实现高速度、低延迟、高时间分辨率的数据输出外，这两款传感器还具有小尺寸但分辨率超高的特点。 集合所有这些优势，以确保在不同环境和情况下立即检测到移动对象。 * 2:在堆栈像素部分（顶部芯片）和逻辑电路（底部芯片）时通过连接的Cu（铜）焊盘实现电气连接的技术。 与通过插入像素区域周围的电极实现连接的硅通孔 …