It integrates single boost Power Factor Correction (PFC) stage and inverter stage in one DIP 36x21D package with DCB substrate, to provide excellent thermal conduction and electrical …

Fully featured interleaved PFC IPM; High PFC switching up to 60 kHz to reduce inductor size; Excellent thermal performance with DCB substrate; Easy heatsink mounting in combination …

600 V, 30 A CIPOS™ Mini 3 Phase Open Emitter intelligent power module (IPM) with TRENCHSTOP™ IGBT and built in NTC in MDIP-24 DCB package.

ipm 的 dcb 陶瓷衬底板可提供更大的载流能力，具有更好的散热性能。目前市场上已能批量供应 800a/1200v 的通用和专用 ipm 模块，其最高水平已达到 1200a/1800v 和 1600a/1500v。

2020年6月1日 · The new IPM provides a compact Infineon Technologies CIPOS™ (Control Integrated POwer System) Mini IPM package measuring 21 mm x 36 mm. All of the …

Fully featured interleaved PFC IPM; High PFC switching up to 60 kHz to reduce inductor size; Excellent thermal performance with DCB substrate; Easy heatsink mounting in combination …

It provides fully featured compact inverter solutions with DCB substrate to enable excellent thermal performance and higher power capability along with excellent thermal conduction and …

integrated intelligent power module (IPM) and the basic requirements for operating the products in a recommended mode. This is related to the integrated components, such as IGBT or gate …

DCB (direct copper bond) substrate is adopted for good thermal performance considering the small package size. This paper provides an overall description of the new PFC-integrated IPM …

The new IPM is UL approved (UL 1557 File E314539) and RoHS compliant. DCB (Direct Copper Bond) which is a substrate with good thermal conductivity is adopted as a substrate for high …