K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging.

k100ld is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot.

K100LD Solder are available at Mouser Electronics. Mouser offers inventory, pricing, & datasheets for K100LD Solder.

Kester K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging.

Kester K100LD 为锡/铜合金 以及控制杂质金属合金熔合，以控制结晶架构在焊料内，让熔铜量减到最小。K100LD 可消除常 见的缺陷如拉尖和短路。改良的结晶结构展现较传统的无铅合金焊点光亮。 Kester K100LD与其他低成本，锡铜的无铅合金有优良的润湿性及流变性。

为了因应低成本和低熔铜率需求， Kester 研发出Ultrapure K100LD。 Kester K100LD 为锡/铜合金以及控制杂质金属合金熔 合， 以控制结晶架构在焊料内， 让熔铜量减到最小。

K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging.

K100LD is a eutectic tin/copper alloy with controlled metallic dopants to control the grain structure within the solder joint and to minimize the dissolution of copper into the solder pot. - K100LD virtually eliminates the occurrence of common defects such as icicling and bridging.

In response to demand for a low cost and low copper dissolution alloy, Kester has developed Ultrapure K100LD. K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and …