Our port­fo­lio cov­ers a wide range – from con­nec­tors to I/O sys­tems, power sup­plies and net­work tech­nol­ogy up to the fast and easy in­stal­lable, mod­u­lar com­plete so­lu­tion for cab­i­net-free au­toma­tion, called Vario-X.

通过提供智能解决方案，穆尔电子助力工业自动化更简单、无缝且经济高效：穆尔电子是分布式电气自动化技术的先驱，基于分布式安装概念的DNA，我们已发展成为该领域的领军企业。 来自穆尔电子的创新解决方案，将信号、数据和电力在生产现场无缝连接，从而逐步实现零控制柜的未来自动化。 50 年来，穆尔电子凭借在行业的专业地位，赢得全球各行各业的客户信赖。 穆尔电子业务遍及 50 多个国家，拥有超过 3,200 名专家的专业团队。 凭借多个全球生产和物流基地，我们 …

Murre is an on-demand, scaleable source of container resource metrics for K8s. Murre fetchs CPU & memory resource metrics directly from the kubelet on each K8s Node. Murre also enriches the resources with the relevant K8s requests and limits from each PodSpec.

Founded in 1951, Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) specialize in developing cutting-edge semiconductor and electronics assembly solutions enabling a smarter and more sustainable future. Our ever-growing range of products and services supports growth and facilitates technology transitions across large-scale markets, such as advanced display, automotive, communications, compute ...

K&S’s next generation of TCB solution, the latest APTURA™ series, offers the first-of-its-kind “fluxless bonding”, enabling direct Cu-to-Cu and bumpless bonding.

With its wide component range and high output, the iFlex T2 is an ideal line balancer between the high passive outputs of the iX and iFlex H1. The Flexline pick and place process brings so much extra value, recognized by many customers.

Kulicke & Soffa (纳斯达克代码: KLIC) 为全球汽车、消费电子、通讯、计算机和工业等领域提供领先的半导体封装和电子装配解决方案。 作为半导体行业的先锋，K&S几十年来致力於为客户 …

2024年8月26日 · Murre is an OSS tool that helps you basically get your container’s CPU & memory metrics without the need to install anything on the cluster. It works the same way as metrics-server just without storing the metrics. With Murre you can filter a specific namespace, pod or even container name to focus on the exact metrics you want.

2025年1月21日 · SINGAPORE, Feb. 1, 2022 / PRNewswire / -- Kulicke and Soffa Industries, Inc. (NASDAQ:KLIC) ("Kulicke & Soffa", "K&S" or the "Company"), a global leader in the design and manufacture of semiconductor, LED and electronic assembly equipment, announced it is expanding its Thermal Compression Bonding (TCB) capabilities to accelerate innovation in the...

2024年8月7日 · Recently, several of Kulicke & Soffa's leading Thermo-Compression offerings have been selected at multiple Assembly & Test customers. In support of the rapid needs for advanced chiplet and stacked-die requirements, these tools will support chip-to-substrate processes targeting applications such as AI, HPC, Mobile and Edge-devices.