
Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort …
2023年9月14日 · Selective laser etching is a promising candidate for the mass production of glass interposers. It comprises two steps: local modification by an ultrashort-pulsed laser and chemical etching of the modified volume.
(PDF) Laser Drilling of High-Density Through Glass Vias
2014年6月19日 · In this article we show how laser processing using deep UV excimer lasers at a wavelength of 193 nm provides a viable solution capable of drilling dense patterns of TGVs with high hole counts....
Optimization of Laser-induced Deep Etching for TGV Fabrication …
Abstract: laser-induced deep etching (LIDE) is a promising technology for efficient and cost-effective through glass via (TGV) manufacturing. In this paper, the effect of nine independently adjustable parameters of LIDE on the TGV properties using ultrashort pulsed lasers was experimentally investigated.
激光诱导深度蚀刻制作高可靠性玻璃过孔(TGV) - 艾邦半导体网
2025年3月18日 · 激光诱导深度蚀刻,英文名 Laser-Induced-Deep Etching,缩写LIDE。 LIDE工艺仅需两个步骤。 第一步,根据设计图形对加工玻璃进行选择性激光改性。在LIDE工艺中,单次激光脉冲即足以产生对全厚度的改性效果,超高的效率适用于大批量的生产需求。 Step 2:
玻璃通孔TGV的形成技术 - 知乎 - 知乎专栏
激光诱导选择性蚀刻 (Laser-Induced Selective Etching,LISE) LISE 是一种 TGV 形成技术,该技术使用激光局部蚀刻照射区域以形成图案。 使用脉冲宽度极短(从飞秒到皮秒)的激光,可以在很短的时间内集中照射高能激光脉冲。 在玻璃基板上形成 TGV 的过程中,激光在短时间内将高能量局部传送到玻璃表面。 这会引起热机械效应,从而改变玻璃的表面膨胀和密度,从而产生对化学蚀刻敏感的区域。 在这些区域用 KOH 等溶液进行化学蚀刻会形成 纳米衍射光栅结构 (称为 …
TGV drilling by Ultrafast Laser with Hollow Beam Optics
However, through the non-linear absorption incurred by ultrafast laser the micro size vias in glass material can be fabricated. In this study, we demonstrated combining non-diffraction Bessel optics and pico-second laser to fabricated high aspect ratio TGV in a few tens of micrometer diameter.
defect-free TGV formation are critical challenges. There was a proposal to handle the ultra-thin glass panels laminating a polymer film on both sides of a glass panel
Laser-drilling formation of through-glass-via (TGV) on polymer ...
2019年6月1日 · A defect-free TGV formation technology in polymer-laminated glass substrates is required to realize a highly reliable 3D glass IPD.
Development of Laser-Induced Deep Etching Process for ... - IEEE …
In this paper, the Laser-Induced Deep Etching (LIDE) technology is used to manufacture TGVs on glass substrate. The LIDE process can be mainly divided into two steps: Initially, picosecond laser is used to modified the glass substrate. Then, using 10% HF etch the modified glass substrate.
EKSPLA飞秒GHz激光器在TGV中的应用 - 艾邦半导体网
2025年3月17日 · EKSPLA 推出的Femtolux 30这款GHz飞秒激光器,通过GHz Burst 加工模式可以形成高深宽比,高质量的TGV。通过GHz Burst 将单个高脉冲能量的脉冲细分到50个小脉冲中,可以实现80:1以上的高深宽比TGV,但是如果玻璃厚度变化,需要精确的控制Burst中脉冲数量以及 …
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