As a leading provider of laser manufacturing solutions, LPKF Laser & Electronics helps to create more powerful electronic systems and increase functionality and efficiency for a broad range of applications and industries. All key figures & information for shareholders.

The compact laser system produces precise, fine structures for demanding PCBs in a very short time. Using a special process, the ProtoLaser S4 quickly removes large copper areas from laminated substrates such as FR4. The ProtoLaser S4 also delivers excellent results on special materials for RF applications.

Equipped with a pico-second laser, the ultra-short pulse laser system LPKF PicoLine 5000 stands for highly precise positioning and accurate processing of PCB materials such as FR4 and PI-, LCP-, and PTFE-FPC in all industry-standard panel sizes.

The LPKF ProtoLaser U4 uses a newly designed, fast vision system optimized for laser micromachining. The camera and the image recognition process capture fiducials or geometric structures on the substrate to be processed.

德国LPKF激光系统能够制造单面和双面印刷电路板,多层,高密度电路板,射频和微波电路板以及刚柔结合电路板,为电子产品研发设计提供完美解决方案。

With LPKF depaneling lasers, a wide variety of rigid substrates from common FR4 materials to ceramics, can be cut quickly, cleanly and cost-efficiently, with no mechanical stress to sensitive components and solder joints.

LPKF PicoLine 5000配备了短脉冲的皮秒激光，应对FR4、PI-、LCP-、PTFE-FPC等PCB材料进行高精度定位和精确加工。 得益于CleanCut短脉冲技术，材料的热影响区域几乎可以忽略不计。 应用范围. LPKF激光解决方案是专门为微加工应用设计的，在24/7的制造环境中，系统的正常运行时间是至关重要的。 乐普科激光系统在许多行业都证明了自己的价值，尤其是在高速和高质量的PCB相关应用领域。 LPKF研发的激光微孔加工工艺，可加工非常广泛的材料和微孔形状，以 …

As a leading provider of laser manufacturing solutions, LPKF Laser & Electronics helps to create more powerful electronic systems and increase functionality and efficiency for a broad range of applications and industries. Redefining PCB depaneling! Discover new dimensions! All key figures & information for shareholders.

The MicroLine 5000 can drill small holes with a diameter as small as 20 μm into various organic and inorganic substrates. Common applications are the drilling of through holes and blind vias, the cutting of large mounting holes as well as the contour cutting of irregular PCB outlines.

LPKF equipment provides the precision necessary for a coordinated SMT prototyping system. One process step is the through-hole plating of the boards. A ProtoMat or a ProtoLaser drills holes in double-sided PCBs or multilayers.