a MEMS device-based, single tilt TEM holder that enables in situ atomic-resolution imaging at elevated temperatures. Before an in situ heating experiment can be performed in a TEM, the nanomaterial of interest needs to be transferred onto the MEMS device. The MEMS device consists of a silicon

2023年1月25日 · In this paper, we report a detailed protocol for the FIB sample preparation of TEM lamellae on MEMS-based chips for in-situ electrical and electro-thermal TEM experiments. For the introduced methodology, a FIB instrument with a micromanipulator, one custom flat holder and one custom holder with a tilt (FIB-optimized E-chip), or two custom flat ...

2024年10月23日 · fib双束系统能够满足mems器件失效分析的高精度和局部可选择性加工要求，快速高效地进行高精度局部切割，移除相应微部件，同时保留其他微部件的完整性。

2022年3月7日 · To address this challenge, a novel method of TEM samples preparation in plan-view geometry was elaborated based on the combination of the wedge polishing technique and an enhanced focused ion beam (FIB) workflow.

2020年12月1日 · We introduce a facile approach to transfer thin films and other mechanically sensitive TEM samples inside a FIB with minimal introduction of stress and bending. The method is making use of a pre-synthetized flexible freestanding Ag nanowire attached to the tip of a typical tungsten micromanipulator inside the FIB.

扫描电子显微镜 (SEM) 是一种介于 透射电子显微镜 和光学显微镜之间的一种观察手段。其利用聚焦的很窄的高能电子束来扫描样品, 通过光束与物质间的相互作用, 来激发各种物理信息, 对这些信息收集、放大、再成像以达到对物质微观形貌表征的目的。 服务项目： 形貌观察、截面观察、 膜厚测量。 特点： 透射电子显微镜的分辨率比光学显微镜高的很多，可以达到0.1～0.2nm，放大倍数为几万～百万倍。 因此，使用透射电子显微镜可以用于观察样品的 精细结构，甚至可以用 …

2024年7月24日 · We present a novel and refined focused ion beam (FIB)-based methodology tailored for the fabrication of clean and artifact-free specimens attached on micro-electro-mechanical-system (MEMS)-based chips for in-situ electrical and electro-thermal experiments in a (scanning) transmission electron microscope ((S)TEM).

2023年1月25日 · A novel focused ion beam (FIB)-based methodology for the preparation of clean and artifact-free specimens on micro-electro-mechanical-system (MEMS)-based chips for in-situ electrical and...

2019年12月5日 · This article presents a method for the preparation of dielectric samples for TEM/STEM investigation under field over a range of temperatures using a commercial MEMS chip support and a Focused Ion Beam (FIB) liftout procedure [16].

2021年6月9日 · Here, we suggested the optical microscopy based manipulating system for in-situ TEM using MEMS chips. By controlling the electrostatic force between tungsten manipulating tip, sample, and substrate, the precise transfer of different sample geometries including micro-sized 2D flake, nanowire, and FIB lamellar have been demonstrated.