2023年3月21日 · TSV (Through Silicon Via)中文为硅通孔技术。 它是通过在芯片与芯片之间、晶圆和晶圆之间制作垂直导通；TSV技术通过铜、钨、多晶硅等导电物质的填充，实现硅通孔的 …

We introduced original TSV technology for MEMS sensor products called SMERALDO, MEMS die size is reduced over 20% in average with keeping same mechanical structure. This can make …

TSV全称为：Through -Silicon-Via，中文译为： 硅通孔技术。 它是通过在芯片和芯片之间、晶圆和晶圆之间制作垂直导通；TSV技术通过铜、钨、多晶硅等导电物质的填充，实现硅通孔的垂 …

近些年新开发出来的 硅通孔互联 (TSV) 技术 为芯片之间的垂直互联提供了有效的途径. 通过 TSV (Through Silicon Vias) 技术可以实现 CMOS, MEMS 以及光电子电路等多种系统的三维混合集 …

2021年8月11日 · Among the four top-down MEMS fabrication approaches, 3D surface micromachining and through-substrate-via (TSV) fabrication technology have been intensively …

2016年5月31日 · In this paper, we present a Through-Silicon-Via (TSV)-based 3D tunable inductor for multiple band filter applications. MEMS (Micro Electro-Mechanical Systems)-based …

In this paper, we present a modified MEMS-casting TSV filling method that uses a nozzle piece, on which surface KOH etched trenches are employed as nozzles. By this improved method, a …

TSVs are high performance interconnect techniques that are key enabling technologies for 3D integration of MEMS. C ompared to 3D techniques such as flip chips, wire bonds, or package …

本文针对基于tsv互连的mems电容式传感器集成进行研究，重点分析基于tsv技术实现mems传感器与接口电路集成后，传感器的性能变化特性，主要研究内容包括： 首先，针对mems传感器集 …

Actual Sil-Via® TSV 3D interposer manufactured for a customer, with edge-to-edge via density, High density TSV (200 µm pitch) and Zero-Crosstalk TM features for digital / analogue GND …