2012年5月29日 · In this study, several crucial WLP technologies are disclosed in detail, including Wafer to Wafer (W2W) bonding, wafer level wire bonding, wafer level compound molding and lapping. Simplified and conceptual process flow of MEMS WLP and development approaches are introduced and explained.

WLP技术包括晶圆级芯片封装(WL CSP)、扇出晶圆级封装、MEMS器件上的晶圆封装和thin film capping、带通硅Via (TSV)的晶圆封装、带集成无源器件(IPD)的晶圆封装以及具有细迹和嵌入集成无源器件的晶圆封装。

This paper reviews wafer-level packaging(WLP) processes of Si interposer, Cu-Sn eutectic bonding of Si-Si and anodic bonding of Si-Glass and getter materials that can be applied on MEMS sensors maintaining high vacuum and long-term reliability.

Wafer level packaging is where a die is packaged while still in wafer form, either singly or combined with additional dies or other components such as discrete passive devices, or functional components like micro-electromechanical systems (MEMS) or radio-frequency (RF) filters.

2014年10月16日 · This paper aims at the warpage characteristics and optimization of the WLP (consisting of silicon MEMS wafer and silicon cover wafer) with glass frit bonding. Finite-element method (FEM) was used to study the warpage and stress optimization of the Si-Si bonding WLP.

Wafer level packaging (WLP) technology offers protection of delicate MEMS structures from ambient environment, providing improved reliability, performance, and reduced cost benefits to meet real world requirements. In simple terms, WLP consists of bonding a cap or a lid wafer on top of a MEMS wafer.

2011年12月1日 · 然而，wlp所采用的自对准晶圆键合技术能够降低这些成本，提高产品性能，缩短推向市场的时间，可公司带来巨大的竞争优势。由于采用塑料封装形式（pbga）会因环氧树脂对mems器件的可动部分和光学传感器造成损害，所以mems器件也多采用wlp封装。

2012年5月1日 · In this study, several crucial WLP technologies are disclosed in detail, including Wafer to Wafer (W2W) bonding, wafer level wire bonding, wafer level compound molding and lapping. Simplified and...

Wafer Level Packaging (WLP) has started to thrive in recent years in IC packaging domain, especially in Micro-Electro-Mechanical System (MEMS) field due to its unique...

2003年10月8日 · 晶片级封装 (WLP)是芯片封装 (CSP)的一种，可以使IC面向下贴装到印刷电路板 (PCB)上，采用传统的SMT安装工艺。 芯片焊盘通过独立的焊球直接焊接到PCB焊盘 (图1)。 WLP技术与球栅阵列、引线型和基于层压成型的CSP封装技术不同，它没有绑定线或引出线。 WLP通常无需填充材料，但是在一些特定应用中，比如移动设备中，填充材料能够增大WLP的机械强度。 WLP的主要优势在于其封装尺寸小、IC到PCB之间的电感很小、并且缩短了生产周期 …