This paper highlights the key advantages of the three-dimensional (3D) MMIC technology in the millimeter-wave frequency band and demonstrates recently developed compact 3DMMICs. This paper also proposes a new methodology for MMIC development based on 3D/multilayer MMIC technology that greatly reduces the costs of millimeter-wave MMICs.

随着 MMIC （Monolithic Microwave Integrated Circuit，单片微波集成电路）的出现，将射频前端分立器件集成在少量芯片中，迅速降低了设计门槛和成本。 例如，下面是一些常见毫米波雷达的MMIC方案：

Novel technology turning MMIC --- 3D. Smaller footprint... Lower cost..... Better performance.....

2020年2月14日 · This work focused on the design, characterization and investigation of GaAs based multi-layered compact 3D MMIC based antenna. Different patch antennas were des

We present a highly integrated quasi-millimeter-wave receiver MMIC that integrates 22 circuits in a 3 x 2.3 mm area using three-dimensional MMIC (3D-MMIC) technology.

This research work was aimed at the design, modelling and investigation of a GaAs based multilayer compact 3D MMIC transmission line. Different transmission lines were designed and modelled using Agilent’s Advanced Design System (ADS) and their Sparameters were extracted using Electromagnetic (EM) simulator momentum.

Since 2008, an aggressive and realistic development of 3-D MMIC Wafer Level Chip Size package (WLCSP); for extremely low cost and surface-mount compatible MMIC products, has been performed to provide a one-stop solution for radio-link equipment developers. This paper will be an example that indicates importance of continuous motivations. 1.

The usage of 3D MMICs is a very powerful technique, especially at quasi-millimeter and millimeter wave levels. We describe the structure and features of 3D MMICs, introduce several MMIC...

TI’s Launch on Package (LoP) technology enables direct signal transmission from the package radiating element to the 3D antenna through the waveguide within the PCB, thereby enabling efficient electromagnetic signal transfer.

2010年6月28日 · Since the 1980s, NTT has been developing three-dimensional (3D) monolith microwave integrated circuits (MMICs) to achieve small-size and low-cost ICs. The usage of 3D MMICs is a very powerful...