Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid
2009年10月1日 · The growth process of Ni 3 Sn 4 in the Sn/Ni liquid/solid reaction interface involves the net effect of several interrelated phenomena, such as volume diffusion, grain …
Characteristics of Reactive Ni3Sn4 Formation and Growth in Ni-Sn ...
2016年3月22日 · Under solid–liquid conditions, the formation of faceted and needle-shaped Ni 3 Sn 4 grains as well as an atypical IMC growth behavior with similar parabolic growth constants …
A study of Ni3Sn4 growth dynamics in Ni-Sn TLPS bonding …
2018年5月10日 · In this paper, the dynamics of Ni-Sn TLPS bonding is researched. The melting enthalpy and the residual rate of Sn in the simulative and actual bonding process were …
mp-20174: Ni3Sn4 (monoclinic, C2/m, 12) - Materials Project
Ni3Sn4 crystallizes in the monoclinic C2/m space group. The structure is three-dimensional. there are two inequivalent Ni sites. In the first Ni site, Ni is bonded in a 6-coordinate geometry to two …
Cu6Sn5和Ni3Sn4结构性能的第一原理计算 - 道客巴巴
2014年3月16日 · 从电子结构的角度，Cu6Sn5的成键主要来自 于 Cu 原子 d，p 轨道与 Sn 原子 p 杂化，而 Ni 原子 d 轨道与 Sn 原子 p 轨道的强烈杂化作用是 Ni3Sn4成键的主要原因．关键 …
First-Principles Study on the Mechanical Properties of Ni3Sn4 …
2025年1月7日 · Ni3Sn4 intermetallic compound (IMC) is a critical material in modern electronic packaging and soldering technology. Although Ni3Sn4 enhances the strength of solder joints, …
Study on the Kinetics of Ni3Sn4 Growth and Isothermal ... - Springer
2022年2月27日 · In this work, the kinetics of Ni3Sn4 growth and the isothermal solidification kinetics in Ni-Sn transient liquid phase sintering bonding process (TLPS bonding) were …
界面Ni3Sn4微观形貌演变对微焊点力学性能的影响 - HWI
摘要: 针对Ni/ (20 μm)Sn/Ni微焊点，研究界面金属间化合物 (IMC)Ni3Sn4微观形貌演变及其对微焊点力学性能的影响，并对拉伸断口进行分析。 结果表明，随着回流时间增加，Ni3Sn4 IMC厚 …
Interfacial reaction of Ni3Sn4 intermetallic compound in …
2016年7月25日 · In the present work, we systematically studied the interfacial reaction of Ni 3 Sn 4 IMC under a temperature gradient during different reflow time when molten SnAg solder …
Effect of Morphological Change of Ni3Sn4 Intermetallic …
2020年3月31日 · In this study, the morphological change of Ni 3 Sn 4 on EL Ni-P and its effects on growth kinetics were analyzed in detail during a reaction with Sn-3.5Ag at 250 ° C for up to …