RDL的全称是（ReDistribution Layer）重布线层，RDL重布线层作为晶圆级封装中的核心技术，起着XY平面电气延伸和互联的作用。 RDL是将原来设计的芯片线路接点位置 (I/O pad)，通过晶 …

2023年3月28日 · The redistribution layer (RDL) technology is a revolutionary packaging solution that has transformed the way we package integrated circuits (ICs). It enables more …

Redistribution layers (RDLs) are the copper metal interconnects that electrically connect one part of the semiconductor package to another. RDLs are measured by line and space, which refer …

2023年10月3日 · An RDL layer provides improved electrical performance. By shortening the signal paths and minimizing the parasitic effects caused by long traces, RDL enables higher …

2013年8月20日 · The redistribution layer (RDL) is the interface between chip and package for flip-chip assembly (Fig. 1). An RDL is an extra metal layer consisting of wiring on top of core …

2013年1月1日 · The redistribution layer (RDL) is a critical component in the power delivery system within heterogeneous 3-D systems, where each layer is individually designed, optimized, and …

Redistribution technology was developed out of necessity to allow fan-in area array packaging (bumping) to take hold when very few chips were being designed for area array.

Abstract Redistribution layer (RDL) is an integral part of 3D IC integration, especially for 2.5D IC integration with a passive interposer. The RDL allows for circuitry fan-outs of and allows...

2017年5月1日 · The last post introduced the use of a polymer dielectric as a redistribution layer (RDL) as a means to fan-out circuit traces from the chip to the backside of the package. In the …

Redistribution Layer (RDL) technology involves adding a patterned metal layer on top of a dielectric layer in integrated circuit (IC) packaging. This process realigns and optimizes …